Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.

Abstract: A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures, Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object, Securing said single-sided film and said substrate together, Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions, Depositing a protective layer incorporating at least said integrated circuit. Also provided is a module obtained by means of the process.

Abstract: An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.

Abstract: An electronic module for a smartcard has a dual, contact and contactless, communication interface. The module includes an electrically insulating substrate on which are produced electrical contact pads enabling operation via contact with corresponding contacts of a smartcard reader, and contact pads for connection to corresponding pads of an antenna located on the body of the smartcard and enabling a contactless operation with a remote smartcard reader. The substrate is coated with a single electrically conductive layer, especially one made of metal, located on the lower face of the electronic module, and the upper face of the electronic module, which face is intended to be flush with the external face of the smartcard, is produced by said electrically insulating substrate, the latter being provided with windows leaving exposed all or some of said electrical contact pads.

Abstract: An electronic module with a dual contact and contactless communication interface, has, on a first face, an electric contact terminal for contact with corresponding contacts of a smart card reader, and, on a second face, an antenna with a coil and a microelectronic chip coated with insulating resin and provided with a contactless communication interface. The antenna has a proximal connection pad and a distal connection pad to be connected to the corresponding terminals of the contactless communication interface of the chip. The proximal connection pad and distal connection pad of the antenna are arranged inside the encapsulation area by an insulating resin, in such a way as to produce a conductive bridge between each proximal connection pad or distal connection pad and the corresponding terminal of the chip, directly via connection wires between said connection pads and the corresponding terminals of the chip, without using vias.

Abstract: An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Abstract: An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Abstract: A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a welding surface in the same plane as at least one of the chip faces. An interconnection pad is provided on the support that is designed to be welded with a corresponding bump contact of the chip. The welding face of each bump contact of the chip is placed opposite each corresponding interconnection pad of the support. Each bump contact of the chip is welded with each corresponding interconnection pad of the support. The method can be applied to a device such as a chip card.

Abstract: The invention aims at the manufacturing of a device having a support associated with at least one microcircuit in the form of a chip, and comprises the replacement of at least one chip having a defect either within it or at its connection to the communication interface; provision is made for:

Abstract: The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.