Abstract: A spacer/mounting assembly preferably comprised of molded plastic is adapted for mounting a four lead power dissipating electronic component, e.g., a rectifier, on a printed circuit (PC) board. The spacer/mounting assembly includes a center aperture and four peripheral apertures. Each of the four peripheral apertures includes a funnel-shaped upper end to facilitate insertion of a respective component lead therethrough to allow the lower end of each of the leads to be attached to and coupled in circuit on the PC board. The center aperture is keyed to receive and engage either a nut or screw head and includes a pair of resilient looking tabs adapted to engage and maintain the nut (or screw) in position within the spacer/mounting assembly. A power dissipating electronic component as well as an optional heat sink may then be easily mounted on an upper portion of the assembly in a secure manner.