Abstract: A pressure sensor to measure low pressures, including: a body extending in a plane, the body including a measurement zone situated at an end of the body, a connection zone situated at another end of the body, the measurement zone including a cavity delimited by a wall, that is deformable under effect of a difference in pressure between inside of the cavity and an external environment, the deformable wall situated at rest in a plane parallel to the plane of the sensor; a mechanism measuring deformation of the deformable wall, the measurement mechanism situated in the cavity; an electrical connection connecting the measurement mechanism to the connection zone, the electrical connection arranged in the body.

Abstract: An electrical connector allowing a connection between two substantially facing electrical contacts respectively pertaining to a housing and a support, and including a main body including a first end for secure connection thereof to the housing and a second end for secure connection thereof to the support, the main body being bent in at least one bending area.

Abstract: The invention provides a method of fabricating an electromechanical structure presenting a first substrate including a layer of monocrystalline material covered in a sacrificial layer that presents a free surface, the structure presenting a mechanical reinforcing pillar in the sacrificial layer, the method including etching a well region in the sacrificial layer to define a mechanical pillar; depositing a first functionalization layer of the first material to at least partially fill the well region and cover the free surface of the sacrificial layer around the well region; depositing a second material different from the first material for terminating the filling of the well region to thereby cover the first functionalization layer around the well region, planarizing the filler layer, the pillar being formed by the superposition of the first material and second material in the well region; and releasing the electromechanical structure by removing at least partially the sacrificial layer.

Abstract: A measuring circuit for a multisensory detector is provided, including a plurality of detection branches mounted in parallel, with each detection branch of said plurality of detection branches including at least two dipoles mounted in series, and at least one reference branch, including a polarizing source and another at least two dipoles mounted in series, with the reference branch being connected in parallel to at least two detection branches among the plurality of detection branches, so as to form a Wheatstone bridge with each one of the detection branches among the plurality of detection branches.

Abstract: A pressure sensor to measure low pressures, including: a body extending in a plane, the body including a measurement zone situated at an end of the body, a connection zone situated at another end of the body, the measurement zone including a cavity delimited by a wall, that is deformable under effect of a difference in pressure between inside of the cavity and an external environment, the deformable wall situated at rest in a plane parallel to the plane of the sensor; a mechanism measuring deformation of the deformable wall, the measurement mechanism situated in the cavity; an electrical connection connecting the measurement mechanism to the connection zone, the electrical connection arranged in the body.

Abstract: An electrical connector allowing a connection between two substantially facing electrical contacts respectively pertaining to a housing and a support, and including a main body including a first end for secure connection thereof to the housing and a second end for secure connection thereof to the support, the main body being bent in at least one bending area.

Abstract: MEMS and/or NEMS differential pressure measurement sensor comprising at least one first membrane and at least one second membrane, each suspended from a substrate, the first membrane having a face subjected to a reference pressure and a second face subjected to a first pressure to be detected, the second membrane having a first face subjected to the reference pressure and a second face subjected to a second pressure to be detected, a rigid beam of longitudinal axis articulated with respect to the substrate by a pivot link around an axis, said beam being solidly connected by a first zone to the first membrane and by a second zone to the second membrane such that the pivot link is situated between the first zone and the second zone of the beam, a sensor of measuring the movement of the beam around the axis, said sensor being arranged at least in part on the substrate.

Abstract: A microdevice encapsulation structure arranged in at least one cavity formed between a substrate and a cap rigidly attached to the substrate is provided, the cap including one layer of a first material, one face of which forms an inner wall of the cavity, and mechanical reinforcement portions rigidly attached at least to and partly covering said face, having gas absorption and/or adsorption properties, in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material, wherein each of said portions includes at least one first layer of the second material, and at least one second layer of a third metallic getter material such that the first layer of the second material is arranged between the layer of the first material and the second layer of the third material and/or is covered by the second layer of the third material.

Abstract: Gyrometer including a substrate and an inertial mass suspended above the substrate, the inertial mass including an excitation part and a detection part, means of moving the excitation part is movable in at least one direction contained in the plane of the inertial mass, and capacitive detection device detecting movement of the detection part outside the plane of the mass. The capacitive detection device includes comprising at least one suspended electrode, located above the detection part located facing the substrate so as to form a variable capacitor with the detection part, the electrode being held above the detection part by at least one pillar passing through the inertial mass.

Abstract: A method for etching a desired complex pattern in a first face of a substrate, including: simultaneous etching of at least a first and a second sub-pattern through the first face of the substrate, the etched sub-patterns being separated by at least one separating wall, a width of the first sub-pattern being greater than a width of the second sub-pattern at the first face, and a depth of the first sub-pattern being greater than a depth of the second sub-pattern in a direction perpendicular to the said first face; and removing or eliminating the separating wall to expose the desired complex pattern.

Abstract: MEMS and/or NEMS differential pressure measurement sensor comprising at least one first membrane and at least one second membrane, each suspended from a substrate, the first membrane having a face subjected to a reference pressure and a second face subjected to a first pressure to be detected, the second membrane having a first face subjected to the reference pressure and a second face subjected to a second pressure to be detected, a rigid beam of longitudinal axis articulated with respect to the substrate by a pivot link around an axis, said beam being solidly connected by a first zone to the first membrane and by a second zone to the second membrane such that the pivot link is situated between the first zone and the second zone of the beam, a sensor of measuring the movement of the beam around the axis, said sensor being arranged at least in part on the substrate.

Abstract: The invention relates to a measuring circuit for a multisensory detector characterized in that it comprises: a plurality of detection branches mounted in parallel, with each one comprising at least two dipoles mounted in series, and, at least one reference branch, comprising a polarizing source and at least two dipoles mounted in series; with said reference branch being connected in parallel to at least two detection branches among the plurality of branches, so as to form a Wheatstone bridge with each one of the detection branches among the plurality of detection branches.

Abstract: A structure (100) for encapsulating at least one microdevice (104) produced on and/or in a substrate (102) and positioned in at least one cavity (110) formed between the substrate and a cap (106) rigidly attached to the substrate, in which the cap includes at least: one layer (112) of a first material, one face of which (114) forms an inner wall of the cavity, and mechanical reinforcement portions (116) rigidly attached at least to the said face of the layer of the first material, partly covering the said face of the layer of the first material, and having gas absorption and/or adsorption properties, and in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material.

Abstract: A method for etching a desired complex pattern in a first face of a substrate, including: simultaneous etching of at least a first and a second sub-pattern through the first face of the substrate, the etched sub-patterns being separated by at least one separating wall, a width of the first sub-pattern being greater than a width of the second sub-pattern at the first face, and a depth of the first sub-pattern being greater than a depth of the second sub-pattern in a direction perpendicular to the said first face; and removing or eliminating the separating wall to expose the desired complex pattern.

Abstract: The invention provides a method of fabricating an electromechanical structure presenting a first substrate including a layer of monocrystalline material covered in a sacrificial layer that presents a free surface, the structure presenting a mechanical reinforcing pillar in the sacrificial layer, the method including etching a well region in the sacrificial layer to define a mechanical pillar; depositing a first functionalization layer of the first material to at least partially fill the well region and cover the free surface of the sacrificial layer around the well region; depositing a second material different from the first material for terminating the filling of the well region to thereby cover the first functionalization layer around the well region, planarizing the filler layer, the pillar being formed by the superposition of the first material and second material in the well region; and releasing the electromechanical structure by removing at least partially the sacrificial layer.

Abstract: A reference electrode includes a reference electrolyte and a proton exchange membrane arranged to separate the reference electrolyte from a medium external to the electrode. The proton-exchange membrane comprises acid-doped polyaniline. The acid-doped polyaniline is in the form of particles distributed in a bonding polymer material.

Abstract: A micromachined electromechanical (MEMS) actuator including, for example, an electrostatically actuated electrical switch, is provided, including a first set of conducting plates forming part of the movable element of the switch, interdigitated with a set of conducting plates forming part of the substrate. The plates are, in principle, vertical relative to the surface of the substrate; they are in partial heightwise overlap and a control voltage applied between the two sets of plates exerts a vertical force acting so as to move the movable element closer to the substrate. The conducting plates of the movable element are connected to one another by conducting end crosspieces connecting the ends of these plates so as to surround, laterally, the stationary conducting plates. The distance separating one stationary plate end from the mobile crosspiece is the same at both ends so that the forces exerted in the elongation direction of the plates cancel out. This distance is preferably the same for all the plates.

Abstract: A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an opening forming an access to the cavity; b) Producing a portion of bond material around the opening, on a surface of the first layer located on the side opposite the cavity; c) Producing, on a second substrate, a portion of fusible material, with a deposition of the fusible material on the second substrate and the use of a mask; d) Placing the portion of fusible material in contact with the portion of bond material; e) Forming a plug for the opening, which adheres to the portion of bond material, by melting and then solidification of the fusible material; f) Separating the plug and the second substrate.

Abstract: Gyrometer comprising a substrate and an inertial mass suspended above the substrate, the inertial mass comprising an excitation part and a detection part, means of moving the excitation part in at least one direction contained in the plane of said inertial mass, and capacitive detection means detecting movement of said detection part outside the plane of said mass, said capacitive detection means comprising at least one suspended electrode, located above the detection part located facing the substrate so as to form a variable capacitor with said detection part, said electrode being held above said detection part by at least one pillar passing through the inertial mass.

Abstract: The invention relates to a method of fabricating an electromechanical device including an active element, wherein the method comprises the following steps: a) making a monocrystalline first stop layer on a monocrystalline layer of a first substrate; b) growing a monocrystalline mechanical layer epitaxially on said first stop layer out of at least one material that is different from that of the stop layer; c) making a sacrificial layer on said active layer out of a material that is suitable for being etched selectively relative to said mechanical layer; d) making a bonding layer on the sacrificial layer; e) bonding a second substrate on the bonding layer; and f) eliminating the first substrate and the stop layer to reveal the surface of the mechanical layer opposite from the sacrificial layer, the active element being made by at least a portion of the mechanical layer.