Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: A dual-directional coupler for measuring true RF power apparent at a radiating element. Incident and reflected power are detected by a pair of detectors. The difference between the two detected voltages is amplified by a differential amplifier to generate a voltage proportional to the true transmitted power.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Abstract: A switch matrix comprising a mulitlayer ceramic circuit board having a M×N array of N×N switch modules. Specifically, the ceramic circuit board has a M×N array of mounting sites for accepting individual N×N switch modules. The ceramic circuit board contains all the necessary interconnects to form a M×N RF switch matrix.

Abstract: A dual-directional coupler for measuring true RF power apparent at a radiating element. Incident and reflected power are detected by a pair of detectors. The difference between the two detected voltages is amplified by a differential amplifier to generate a voltage proportional to the true transmitted power.

Abstract: An array antenna includes a first ceramic layer and a second ceramic layer. A metal layer is disposed between the first and second ceramic layers. A plurality of radiating elements are mounted on the first ceramic layer, and a plurality of control circuits are mounted on the second ceramic layer. The control circuits are coupled to the radiating elements through a plurality of conductive vias which feed through the metal layer. The array antenna may also include a switch having a plurality of poles formed in the second ceramic layer and coupled to one of the radiating elements through one or more conductive vias. A plurality of phase delay elements may be coupled at a first end to a signal source and coupled at a second end to the respective plurality of poles of the switch to provide phase-delayed signals. A waveguide may also be formed within the ceramic layers. Conductive vias or coaxial transmission lines may be used to connect elements within the array antenna.

Abstract: An array antenna includes a first ceramic layer and a second ceramic layer. A metal layer is disposed between the first and second ceramic layers. A plurality of radiating elements are mounted on the first ceramic layer, and a plurality of control circuits are mounted on the second ceramic layer. The control circuits are coupled to the radiating elements through a plurality of conductive vias which feed through the metal layer. The array antenna may also include a switch having a plurality of poles formed in the second ceramic layer and coupled to one of the radiating elements through one or more conductive vias. A plurality of phase delay elements may be coupled at a first end to a signal source and coupled at a second end to the respective plurality of poles of the switch to provide phase-delayed signals. A waveguide may also be formed within the ceramic layers. Conductive vias or coaxial transmission lines may be used to connect elements within the array antenna.

Abstract: An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.

Abstract: A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked and bonded to each other and has at least one opening extending therethrough to the base plate. Strips of a conductive material, such as a metal, are on the surface of various layers of the body. An electronic component is mounted in the opening in the body and has terminals which are electrically connected to the conductive strips on the body, preferably by wires. Vias of a conductive material may extend through some of the layers of the body to connect the conductive strips to terminals on the surface of the body. A cover plate of an insulating material may extend over the body and the opening therein to enclose the electronic component in the body.