Abstract: An electronic board including an area forming a BGA type electronic component backing, and an electric heating resistor which supplies an amount of heat for soldering the component onto the plate is disclosed. The board includes a plurality of conductive layers alternating with electrically insulating layers, the resistor forming one of the conductive layers immediately underlying the surface layer. The board may also include a thermal drain. A facility for implementing the method is also disclosed. It allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: This invention is related to an electronic board comprising an area forming a BGA type electronic component backing, an electric heating resistor at right angle to said area, said resistor being able to supply an amount of heat for soldering the component onto the plate, characterized in that the board comprises a plurality of conductive layers alternating with electrically insulating layers, said resistor forming one of the conductive layers immediately underlying the surface layer. The board comprises, if need be, a thermal drain. This invention is also related to a facility for implementing the method. It also allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

Abstract: The invention relates to a process for soldering an electronic component onto a support comprising at least one heat drain for the said component, using solder paste incorporating a stripping flux activated at a first temperature, and a solder alloy melting at a second temperature. The process is characterised by the fact that it consists of: preheating the support on the face opposite the component through the heat drain up to the said first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature. The invention also relates to an installation for implementing the process. It is also used for the repair of an electronic card by replacing defective elements without the risk of unsoldering or damaging adjacent elements.