Abstract: A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.

Abstract: A probe system, mixed primary reference probe for an aircraft, associated aircraft and measuring method are disclosed. In one aspect, the probe system includes a base designed to be fastened on the cockpit of an aircraft, a plurality of regularly spaced static pressure taps, arranged through the base and designed to be connected to a pressure measurement device. The system includes at least one optical window transparent to laser radiation and inserted into the base.

Abstract: A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.

Abstract: A probe system, mixed primary reference probe for an aircraft, associated aircraft and measuring method are disclosed. In one aspect, the probe system includes a base designed to be fastened on the cockpit of an aircraft, a plurality of regularly spaced static pressure taps, arranged through the base and designed to be connected to a pressure measurement device. The system includes at least one optical window transparent to laser radiation and inserted into the base.

Abstract: A process is provided for producing a printed circuit board comprising at least two elementary circuit boards drilled with metallized holes the mouth of which is covered with a first metal, and at least one first intermediate layer, made of a compressible material, drilled with holes facing the elementary circuit boards and the mouth of which is covered with a second metal, which layer is placed between the two elementary circuit boards and soldered to each of the circuits by thermodiffusion of two metals forming an alloy at a formation temperature of the alloy. At least two second intermediate layers, the second layers not covering the first and second metal, being thermoplastics and having a melting point above the formation temperature of the alloy, are placed between the first intermediate layer and the elementary circuit boards.

Abstract: The invention relates to an aeronautical probe designed to be mounted on the skin of an aircraft and comprising a probe body protruding from the skin of the aircraft and a heater for de-icing an external surface of the probe body. According to the invention, the heater comprises two self-supporting electrodes and heating resistive elements. Each electrode is formed of an electrically insulating substrate and of an electrically active portion forming one face of the electrode in question. Each resistive element is in contact with the faces of the electrodes. The notable advantages of the invention are that it makes it possible to reduce the operating temperature of the resistive elements and the phenomena of fatigue in the mechanical link between the electrodes and the resistive elements due to different expansion coefficients.

Abstract: The invention relates to an aeronautical probe designed to be mounted on the skin of an aircraft and comprising a probe body protruding from the skin of the aircraft and a heater for de-icing an external surface of the probe body. According to the invention, the heater comprises two self-supporting electrodes and heating resistive elements. Each electrode is formed of an electrically insulating substrate and of an electrically active portion forming one face of the electrode in question. Each resistive element is in contact with the faces of the electrodes. The notable advantages of the invention are that it makes it possible to reduce the operating temperature of the resistive elements and the phenomena of fatigue in the mechanical link between the electrodes and the resistive elements due to different expansion coefficients.

Abstract: The invention relates to a microwave package delimiting an interior volume, comprising a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.

Abstract: The invention relates to a microwave package delimiting an interior volume, comprising: a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.

Abstract: The present invention relates to a process for producing interconnects in a multilayer printed circuit. Said circuit comprising a stack of printed circuits.

Abstract: An insulating electrical feed-through connector extending through a wall of aluminium is obtained by using a sintered sleeve comprising phosphate glass in which a conductive pin is inserted. The sleeve is raised to a firing temperature in excess of the dilatometric softening temperature of the vitreous material in the presence of a first effective quantity of alumina between the sleeve and the wall and of a second effective quantity of nickel oxide between the sleeve and the pin, which makes it possible to achieve a simultaneous and direct hermetic sealing of the sleeve to the wall and of the pin to the sleeve.

Abstract: An insulating electrical feed-through connector extending through a wall of aluminum is obtained by using a sintered sleeve comprising phosphate glass in which a conductive pin is inserted. The sleeve is raised to a firing temperature in excess of the dilatometric softening temperature of the vitreous material in the presence of a first effective quantity of alumina between the sleeve and the wall and of a second effective quantity of nickel oxide between the sleeve and the pin, which makes it possible to achieve a simultaneous and direct hermetic sealing of the sleeve to the wall and of the pin to the sleeve.