Patents by Inventor Bernard Li

Bernard Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11642519
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: May 9, 2023
    Assignee: MEDTRONIC, INC.
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Patent number: 11278717
    Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: March 22, 2022
    Assignee: Medtronic, Inc.
    Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
  • Patent number: 10537730
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: January 21, 2020
    Assignee: MEDTRONIC, INC.
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Publication number: 20190358447
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Application
    Filed: August 9, 2019
    Publication date: November 28, 2019
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Patent number: 10398893
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: September 3, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Publication number: 20190060636
    Abstract: A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Inventors: Thomas J. Steigauf, Eric H. Bonde, Phillip C. Falkner, Jeevan M. Prasannakumar, Brian T. Stolz, John Shishilla, Adam J. Rivard, Robert Sandgren, Seth Humphrys, Bernard Li
  • Patent number: 9284648
    Abstract: The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: March 15, 2016
    Assignee: Medtronic, Inc.
    Inventors: Alan Shi, Bernard Li
  • Publication number: 20150258335
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Application
    Filed: May 20, 2015
    Publication date: September 17, 2015
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Patent number: 9044593
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: June 2, 2015
    Assignee: MEDTRONIC, INC.
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Patent number: 8805537
    Abstract: Described herein is a device configured to be implanted into a live human or animal. The device includes an electrically non-conductive frame; one or more electrical components disposed in the electrically non-conductive frame; and a self-supporting film. The self-supporting film forms a hermetical seal with the electrically non-conductive frame. The self-supporting film and the frame enclose the electrical components. The device is configured to be implanted into a live human or animal. Also described herein is a method of making a device configured to be implanted into a live human or animal. The method includes providing an electrically non-conductive frame comprising one or more feedthroughs, openings and a cavity; disposing electrical components within the cavity; optionally filling the cavity with a material to embed the electrical components in the material; and sealing the openings by applying a self-supporting film to the one or more openings.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 12, 2014
    Assignee: Medtronic, Inc.
    Inventors: Peng Cong, Bernard Li
  • Publication number: 20120273090
    Abstract: The invention describes a method and compositions where the presence of cobalt and or nickel have been depleted from the surface layer(s) of a cobalt, chromium, nickel containing alloy.
    Type: Application
    Filed: April 16, 2012
    Publication date: November 1, 2012
    Inventors: Alan Shi, Bernard Li
  • Patent number: 7801613
    Abstract: The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 21, 2010
    Assignee: Medtronic, Inc.
    Inventors: Bernard Li, Reginald D. Robinson, John E. Kast
  • Publication number: 20080269829
    Abstract: The housing of an implantable medical device is made of a titanium alloy that provides improved electrical performance, mechanical strength, and reduced MRI heating. The titanium alloy housing includes portions formed by metal injection molding and welded together. Wall thickness of at least a portion of one major face of the housing is reduced by chemical etching a metal injected molded housing portion.
    Type: Application
    Filed: April 26, 2007
    Publication date: October 30, 2008
    Applicant: Medtronic, Inc.
    Inventors: Bernard Li, Reginald D. Robinson, John E. Kast
  • Publication number: 20080195186
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a material that is electrically conductive, where the material is in a wrapped or woven form. The material is selected so as to have an effective combination of small size and high conductive surface area, e.g., as opposed to metal wire or coatings thinner than metal wire. As such, the shield covering exhibits sufficient conductivity in the presence of one or more high frequency electromagnetic fields so that interference to the operation of the conductor assembly is minimized. The material can have a coating formed of one or more metals. The material can include carbon. In turn, the carbon can be formed of one or more of carbon fiber, carbon nanofiber, and single or multi-walled carbon nanotube.
    Type: Application
    Filed: February 14, 2007
    Publication date: August 14, 2008
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Publication number: 20080195187
    Abstract: A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
    Type: Application
    Filed: February 14, 2007
    Publication date: August 14, 2008
    Inventors: Bernard Li, Chad Cai, Xingfu Chen
  • Publication number: 20070251289
    Abstract: A method includes applying a constant force to at least a portion of a component configured for use in a medical device and while the constant force is applied, subjecting the component to a temperature above ambient temperature for an amount of time sufficient to-improve the flatness of the component.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventor: Bernard Li
  • Publication number: 20050013539
    Abstract: An optical coupling system having an integrated micro lens system for achieving high coupling efficiency between an optoelectronic element and an optical medium such as an optical fiber. The system may have a posts formed on the wafer incorporating the optoelectronic elements. The posts may have micro lenses formed on them. The posts with their respective micro lenses may be situated over respective optoelectronic elements. A window may be formed over the wafer components that may include micro lenses, posts and optoelectronic elements. The window may be part of the package that hermetically seals these components. An optical fiber or an array of fibers may be positioned proximate to the window for the receiving or transmitting of light. The optical coupling system may instead have an aspherical lens situated between the optoelectronic component and optical fiber. The fiber may be in contact with the near lens surface.
    Type: Application
    Filed: July 17, 2003
    Publication date: January 20, 2005
    Inventors: Bo Chen, Bernard Li
  • Publication number: 20050013553
    Abstract: An optical coupling system having a split sleeve with a metallized strip adhered to a housing barrel at one end. The sleeve may be smaller than an optical fiber ferrule. The sleeve may have spring-like flexibility and be stretched open at the slit sufficiently to permit insertion of the ferrule in the sleeve. The sleeve may be made of zirconia. The ferrule may be held by the sleeve's spring-like contraction around the ferrule. Attached at the other end of the barrel may be an optoelectronic element such as a vertical cavity surface emitting laser. An optical fiber end of the ferrule may be aligned with the laser. Since the ferrule may be held firmly by the sleeve attached to the coupling barrel, there would be virtually no movement or wiggle of the fiber end relative to the laser and thus the alignment may be maintained.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 20, 2005
    Inventors: Raymond Blasingame, James Lee, Bernard Li
  • Publication number: 20050014390
    Abstract: Methods and devices for handling wafers during wafer processing are provided. One embodiment includes an apparatus for holding a wafer. The holding apparatus includes a pocket for receiving a wafer, and may include a mechanism allowing for the wafer to be secured within the pocket. Methods are also included for preparing a wafer for fabrication processes by the use of a wafer holding apparatus. These methods may include applying a layer of photoresist to the surface of a wafer.
    Type: Application
    Filed: July 18, 2003
    Publication date: January 20, 2005
    Inventor: Bernard Li
  • Publication number: 20050013542
    Abstract: A coupler for coupling light between an optoelectronic element and an optical fiber. The coupler has a fiber stop that is made of a material that has an index of refraction that effectively matches the index of refraction of the optical fiber being coupled to the optoelectronic element. The fiber stop may be flat or rounded. It may be a discrete or molded part of the coupler assembly. The end of the fiber being stopped may be flat or rounded.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 20, 2005
    Inventors: Raymond Blasingame, Bo Chen, James Guenter, James Lee, Bernard Li, James Orenstein