Abstract: A process for continuous nickel plating of an aluminum conductor, by electrolytically pre-treating the aluminum conductor to improve adherence of a nickel coat thereon by passing the aluminum conductor through a pre-treating bath in which is disposed an electrode connected to a first current source at a first voltage, for supplying to the aluminum conductor a pre-treating current, then electrolytically plating the pre-treated aluminum conductor with nickel in a plating bath in which is disposed an anode connected to a second current source at a second voltage, in which a nickel coat is deposited on the conductor by action of a nickel plating current In. At least the nickel plating current In is transmitted to the conductor through a mechanical electrical contact which contacts the conductor between the pre-treating bath and the plating bath, the pre-treating improving the contact properties of the conductor sufficient to permit the transmitting through the mechanical electrical conductor.

Abstract: A continuous nickel plating process for at least one aluminum conductor includes a pre-treatment step P that improves the adherence of a nickel coat, and an electrolytic nickel plating step N, and is characterized in that the contact properties of the conductor after the pre-treatment step P are sufficient to enable a mechanical electrical contact, and in that the nickel plating current (In=I1) is transmitted to the conductor through a mechanical electrical contact on the part of the conductor output from the pre-treatment step (P). The invention is also directed to a device including a nickel plating tank with a receptacle that can contain a nickel plating bath and at least one electrode called the anode, containing nickel, at least one electrical power supply to apply a voltage (V1) between the electrode, or each electrode, and the conductor or each conductor, and means for moving the conductor in the nickel plating bath.