Abstract: A method for producing a matrix of electromagnetic radiation detectors made up of a plurality of elementary detection modules mounted on an interconnection substrate. The method includes depositing on the interconnection substrate a predefined number of quantities of solder or hybridization material, intended to constitute hybridization bumps for the elementary modules, in at least a first array for the nominal hybridization, and at least one second array, with the deposits of solder or hybridization material of the second array being lower in volume than those of the first array, depositing a liquid flux on the interconnection substrate, mounting the elementary modules to be hybridized on the interconnection substrate, and raising the temperature of a chamber in which the various elements to be hybridized are positioned until reaching at least the melting point of the solder or hybridization material to join the modules and interconnection substrate together by reflow effect.

Abstract: Disclosed is a method for producing an array for detecting electromagnetic radiation, the array including a elementary detection modules mounted on an interconnect substrate, the modules comprising at least one circuit for detecting the radiation, connected to a read circuit by hybridization, the read circuits being attached to the interconnect substrate, the method including making, on the rear face of read circuit of each of the elementary modules grooves or slots, and areas without such grooves or slots; mounting, on the front face of the interconnect substrate, and on the front face of the detection circuit, registration features that ensure accurate positioning of each of the elementary modules on the interconnect substrate; pressing each elementary module onto the interconnect substrate after positioning; ensuring migration of the adhesive through grooves or slots; raising the temperature of the chamber used to produce the array to cure of the adhesive.

Abstract: This method for producing an array for detecting electromagnetic radiation comprises a plurality of elementary detection modules 2 mounted on an interconnect substrate, said modules 2 themselves comprising at least one circuit 4 for detecting said radiation, connected to a read circuit 3 by hybridization, said read circuits themselves being attached to the interconnect substrate, involves: making, on the rear face 15 of read circuit 3 of each of the elementary modules 2: grooves or slots 16, and areas 17 without such grooves or slots; mounting, firstly on the front face of the interconnect substrate, and secondly on the front face of the detection circuit, registration features 12, designed to ensure accurate positioning, especially on the X and Y axes, of each of the elementary modules 2 on said interconnect substrate; bringing about pressing of each of elementary modules 2 onto the interconnect substrate after positioning of said modules; ensuring migration of the adhesive through grooves or slots 1

Abstract: A method for producing a matrix of electromagnetic radiation detectors made up of a plurality of elementary detection modules mounted on an interconnection substrate. The method includes depositing on the interconnection substrate a predefined number of quantities of solder or hybridization material, intended to constitute hybridization bumps for the elementary modules, in at least a first array for the nominal hybridization, and at least one second array, with the deposits of solder or hybridization material of the second array being lower in volume than those of the first array, depositing a liquid flux on the interconnection substrate, mounting the elementary modules to be hybridized on the interconnection substrate, and raising the temperature of a chamber in which the various elements to be hybridized are positioned until reaching at least the melting point of the solder or hybridization material to join the modules and interconnection substrate together by reflow effect.

Abstract: A parallelepipedic detection wafer of type p made of Hg Cd Te is taken, islets or raised zones are formed from the front face and their structure is rounded, zones of type n are diffused from the front face, in order to form junctions, metallic contact terminals are formed from the front face up to the bottom level of the raised zones, the detection wafer is thinned from the rear face, the terminals are isolated, the pieces of raised zones are attached by the rear face on a processing wafer and the terminals are welded on metallization zones of the processing wafer. The invention enables an infrared detector for camera to be manufactured.