Abstract: Various exemplary methods, systems, and devices for gathering and analyzing data for robotic surgical systems are provided. In general, the methods, systems, and devices can allow data to be gathered regarding use in a surgical procedure of a robotic surgical system that includes a plurality of movable arms each configured to couple to a surgical instrument. The gathered data can be used to determine a recommended initial position of the arms for future surgical procedures using the robotic surgical system. The recommended initial position can be provided to users of the robotic surgical system in the future surgical procedures.

Abstract: Various exemplary methods, systems, and devices for gathering and analyzing data for robotic surgical systems are provided. In general, the methods, systems, and devices can allow data to be gathered regarding use in a surgical procedure of a robotic surgical system that includes a plurality of movable arms each configured to couple to a surgical instrument. The gathered data can be used to determine a recommended initial position of the arms for future surgical procedures using the robotic surgical system. The recommended initial position can be provided to users of the robotic surgical system in the future surgical procedures.

Abstract: A nondestructive bond testing system is implemented using a pulse laser that sends a single or multiple pulse(s) of controlled magnitude and bombards an object of interest causing a thermoelastic excitation response. This excitation in turn induces an ultrasonic propagation along or through the surface material. By detecting, capturing and interpreting these thermoelastic propagation signatures, the attachment condition of the joining materials is determined. The technique is a significant improvement over traditional mechanical pull, shear or contact type techniques. The techniques are implemented in automated high speed inspection systems suitable for real time manufacturing application. Particular applications include evaluating material joining in microelectronics manufacture (such as ball bonds) and thin coating processes.

Abstract: The present invention is directed to an improved system for inspection of microelectronic assemblies, including chips and interconnection elements such as wires, ball bonds, and wedge bonds contained therein. This system includes a high speed illumination subsystem, a dual magneification video camera sensor subsystem, a commercial machine vision system supported by a video display and printer, a three dimensional transport stage for moving the microcircuit under inspection, and a computer controller for operational control under unique software of all of the above system elements. The illumination subsystem includes formation of multiple light rings starting with light generated by a tungsten lamp, collimation by a condenser lens, then passage through a liquid crystal light valve having a plurality of circular active transmission areas.

Abstract: This invention is a high speed illumination apparatus and technique which highlights bond wires, ball bonds, bond wedges and microcircuit chips separately against a similar substrate background for manual or high speed automatic inspection of microelectronics assemblies. Preferred angles of illumination are provided which reflect off the different specular surfaces of the bond wires, wire bonds, and bond wedges, providing improved background contrast. Light projected on the flat surfaces of microchip bodies tends to be absorbed, producing a negative contrast shadow if the other elements are illuminated in parallel. Formation of the multiple light rings starts with light generated by a tungsten lamp, collimation by a condenser lens, then passage through a liquid crystal light valve having a plurality of circular active transmission areas.

Abstract: This invention is a high speed illumination apparatus and technique which isolates bond wires, ball bonds, bond wedges and microcircuit chips exclusively for manual or high speed automatic inspection of microelectronics assemblies. This system consists of multiple concentric rings of illumination, which are focused towards the center of the rings, but from different angles of incident. Light from these angles reflect off the different specular surfaces of the bond wires, wire bonds, and bond wedges, providing background contrast. Light projected on the flat surfaces of microchip bodies tends to be absorbed, producing a negative contrast shadow if the other elements are illuminated in parallel. Unique angles of incidence provide substantial illumination contrasts between the areas of interest and its neighboring surfaces. The reflections provide unique signatures which are easily distinguishable by an image processing system.