Abstract: Integrated inspection and test systems for liquid crystal display (LCD) active plates. The integrated inspection and test systems may combine visual imaging inspection and an electronic sensing such as voltage imaging, electron beam sensing or charge sensing, in which the potential defect information obtained by the visual inspection system is combined with the potential defect information obtained by the electronic sensing system to produce a defect report. One or more high-resolution visual cameras are scanned over a stationary plate, and the image data from the camera(s) is processed to detect potential defects. A high-resolution electronic sensing system examines the stationary plate, and the image data from the sensor(s) is processed to detect potential defects. The potential defects from the visual image data and electronic sensing image data are processed to produce the final defect information.

Abstract: Integrated inspection and test systems for liquid crystal display (LCD) active plates. The integrated inspection and test systems may combine visual imaging inspection and an electronic sensing such as voltage imaging, electron beam sensing or charge sensing, in which the potential defect information obtained by the visual inspection system is combined with the potential defect information obtained by the electronic sensing system to produce a defect report. One or more high-resolution visual cameras are scanned over a stationary plate, and the image data from the camera(s) is processed to detect potential defects. A high-resolution electronic sensing system examines the stationary plate, and the image data from the sensor(s) is processed to detect potential defects. The potential defects from the visual image data and electronic sensing image data are processed to produce the final defect information.

Abstract: Heat is removed from a Large Scale Integrated Circuit semiconductor package via a thermal conductive path including a thermally conductive liquid. The integrated circuit chips are flip chip bonded to a substrate having a printed circuit and raised contact pads serving to interconnect contact areas on the chip. A metal, ceramic (or combination thereof) cover engages the perimeter of the substrate and encloses the chips (or chip). The thermal liquid is contained within the cavity define by the cover and substrate. The chips (or chip) and the flip chip connections are protected from contamination and the deleterious effects of the thermally conductive liquid by a parylene film enveloping same. Additionally, back side bonded (beam lead) integrated circuit chips will have an enhanced heat transfer path by incorporating liquid metal and a protective coating of parylene.