Patents by Inventor Bernard Wilhelm Vetten

Bernard Wilhelm Vetten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anti-pad for a printed circuit board
    Patent number: 10925150
    Abstract: A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: February 16, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Bin Lin, Bernard Wilhelm Vetten, Eric DiBiaso
  • ANTI-PAD FOR A PRINTED CIRCUIT BOARD
    Publication number: 20210022240
    Abstract: A printed circuit board includes a substrate having a plurality of stacked circuit board layers. The substrate has a top surface and a bottom surface. The printed circuit board includes a signal contact on the substrate. The signal contact has a signal via and a signal trace extending from the signal via. The signal via extends between the top surface and the bottom surface along a via axis. The printed circuit board includes an anti-pad around the signal via extending through the substrate along the via axis. The anti-pad extends between the top surface and the bottom surface. The anti-pad has a first width at the top surface and the lower anti-pad has a second width at the bottom surface different than the first width.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 21, 2021
    Inventors: Bin Lin, Bernard Wilhelm Vetten, Eric DiBiaso