Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

Abstract: The invention relates to a thermoplastic composition comprising: a) 20 to 90 wt % of a thermoplastic resin, b) a laser direct structuring additive, c) optionally ceramic filler particles which do not have a laser direct structuring additive function and d) 0.1 to 5.0 wt % of an acid-modified polymer, wherein b) comprises b1) a conductive metal oxide, wherein the conductive oxide has a resistivity of at most 5×103 ?·cm and contains at least a metal of Group n of the periodic table and a metal of Group n+1, wherein n is an integer of 3 to 13, and/or b2) calcium copper titanate.

Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

Abstract: A thermoplastic composition including: a) an aromatic polycarbonate resin; b) a laser direct structuring additive and c) a polyarylate resin, wherein the total amount of the components a) and c) is 75-99.5 wt. % with respect to the total composition, wherein a molded part of the composition has UL94 V1 or V0 rating at a thickness of 3.0 mm (±10%) and/or UL94 V1 or V0 rating at a thickness of 1.5 mm (±10%).

Abstract: Provided is a polycarbonate resin composition that exhibits an excellent light resistance and an excellent resistance to moist heat and is free of the problem of mold staining. The polycarbonate resin composition comprises 0.12 to 0.8 mass parts of an N-alkyl hindered amine compound (C-1) and/or 0.12 to 0.8 mass parts of an N—OR hindered amine compound (C-2), per 100 mass parts of the total of (A) and (B) composed of more than 50 mass parts to not more than 95 mass parts of an aromatic polycarbonate resin (A) and less than 50 mass parts to at least 5 mass parts of an aromatic vinyl-diene-vinyl cyanide copolymer (B).

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminum and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

Abstract: A thermoplastic composition including: a) 30-97 wt % of an aromatic polycarbonate; b) 0.5-25 wt % of a laser direct structuring additive; and c) 2-15 wt % of a methylmethacrylate butadiene styrene based rubber; d) 0.1-15 wt % of one or more conductive track adhesion agents selected from the group consisting of an organic phosphate, a phosphazene compound and a hypophosphorous acid metal salt, wherein a molded part of the composition provided with a conductive track made by a laser radiation and a subsequent metallization has a classification 0 as determined according to ISO2409:2013 after being subjected to conditions of 65° C. and 85% Relative Humidity for 24 hours.

Abstract: A thermoplastic composition including a) a1) a thermoplastic resin and a2) a silicon containing rubber and/or b) a polysiloxane-polycarbonate copolymer; and c) a metal (oxy)hydroxide with BET surface area of at least 10 as determined by DIN ISO 9277: 2010.

Abstract: A thermoplastic composition including a) a1) a thermoplastic resin and a2) a silicon containing rubber and/or b) a polysiloxane-polycarbonate copolymer; and c) a metal (oxy)hydroxide with BET surface area of at least 10 as determined by DIN ISO 9277: 2010.

Abstract: The present invention relates to a polymer composition comprising the following components: a) 76.6-99.9 mass % of aromatic polycarbonate, b) 0.5-20 mass % of laser direct structuring additive, c) 0-2.4 mass % of rubber like polymer, and d) 0.01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such molded part and to a process for producing such circuit carrier.

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract: The present invention relates to a polymer composition comprising the following components: a) 76,6-99,9 mass % of aromatic polycarbonate, b) 0,5-20 mass % of laser direct structuring additive, c) 0-2,4 mass % of rubber like polymer, and d) 0,01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.

Abstract: The present invention relates to a polymer composition comprising the following components: a) 76.6-99.49 mass % of aromatic polycarbonate, b) 0.5-20 mass % of laser direct structuring additive, c) 0-2.4 mass % of rubber like polymer, and d) 0.01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract: A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive in an amount of at least 1 wt % with respect to the weight of the total composition, the laser direct structuring additive containing tin or copper comprising antimony-doped tin oxide and having a CIELab colour value L* of at least 45 and irradiating areas of the part on which conductive tracks are to be formed with laser radiation, and subsequently metalizing the irradiated areas.

Abstract: The present invention relates to a polymer composition comprising the following components: a) 76.6-99.49 mass % of aromatic polycarbonate, b) 0.5-20 mass % of laser direct structuring additive, c) 0-2.4 mass % of rubber like polymer, and d) 0.01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.

Abstract: The present invention relates to a polycarbonate composition comprising: a) aromatic polycarbonate in an amount higher than 85 wt %, b) laser direct structuring additive in an amount of at least 0.5 wt %, c) sulphonate salt in an amount of at least 0.001 wt. %, and d) 0-2.4 wt. %. of rubber like polymer wherein the mass % is calculated relative to the sum of components a), b), c) and d). The present invention further relates to the use of a sulphonate salt in a composition comprising aromatic polycarbonate and a laser direct structuring additive and being substantially free of a rubber like polymer for increasing the Izod Notched impact strength at 23° C. (measured at a sample thickness of 3.2 mm or less according to ISO 180/4A) of a molded part of the polycarbonate composition.

Abstract: A composition comprises a polyester-polycarbonate polymer comprising isophthalate-terephthalate-resorcinol ester units and carbonate units, a poly(C4-alkylene) ester, and a polyester comprising cyclohexanedimethylene terephthalate units, or a combination of cyclohexanedimethylene terephthalate and ethylene terephthalate. The composition can be extruded into pellets that are clear and colorless. The composition can further be molded into articles having a percent haze value less than or equal to 10 percent, and total luminous transmittance value of greater than or equal to 70 percent, measured in accordance with ASTM D1003-00. Also disclosed is a method for forming the compositions, and articles prepared therefrom.