Patents by Inventor Bernd Beyer

Bernd Beyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210206292
    Abstract: The invention provides a temperature-control element (5) with two covering plates (8) which are arranged at a distance from one another and delimit an intermediate space within which a supporting structure (23) is arranged, said supporting structure keeping the covering plates (8) at a distance from one another, wherein a sorption material (7) which makes contact with the covering plates (8) and the supporting structure (23) is additionally accommodated in the intermediate space. A temperature-control element (5) of this kind allows particularly good transfer of thermal energy between the sorption material (7) and the covering plates (8) by way of the supporting structure (23) not only serving to mechanically connect the covering plates (8) and therefore provide structural strength to the temperature-control element (5) but also causing a transfer of thermal energy between the sorption material (7) and the covering plates (8).
    Type: Application
    Filed: July 25, 2019
    Publication date: July 8, 2021
    Inventors: Bernd Beyer, Walter Mittelbach, Andreas Gähme, Charles Peurois
  • Patent number: 8537556
    Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: September 17, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Patent number: 8441803
    Abstract: A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 14, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Publication number: 20090257206
    Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 15, 2009
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Publication number: 20090251871
    Abstract: A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 8, 2009
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Patent number: 6875014
    Abstract: In a method for monitoring a combustion process, in which, in a oven, a substance arranged in a bed of the oven is converted under the supply of heat by way of firing by a flame, data of the flame and/or the substance in the bed being recorded by way of at least one sensor, the input of heat into the bed is determined from the data recorded by the sensor and is used for quality determination.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: April 5, 2005
    Assignee: Powitec Intelligent Technologies GmbH
    Inventors: Dirk Schmidt, Bernd Beyer, Franz Wintrich
  • Publication number: 20040214123
    Abstract: In a method for monitoring a combustion process, in which, in a oven, a substance arranged in a bed of the oven is converted under the supply of heat by way of firing by a flame, data of the flame and/or the substance in the bed being recorded by way of at least one sensor, the input of heat into the bed is determined from the data recorded by the sensor and is used for quality determination.
    Type: Application
    Filed: May 20, 2004
    Publication date: October 28, 2004
    Applicant: POWITEC INTELLIGENT TECHNOLOGIES GMBH
    Inventors: Dirk Schmidt, Bernd Beyer, Franz Wintrich