Abstract: A semiconductor device includes: an n-doped drift region between first and second surfaces of a semiconductor body; a p-doped first region at the second surface; and an n-doped field stop region between the drift and first region. The field stop region includes first and second sub-regions with hydrogen related donors. A p-n junction separates the first region and first sub-region. A concentration of the hydrogen related donors, along a first vertical extent of the first sub-region, steadily increases from the pn-junction to a maximum value, and steadily decreases from the maximum value to a reference value at a first transition between the sub-regions. A second vertical extent of the second sub-region ends at a second transition to the drift region where the concentration of hydrogen related donors equals 10% of the reference value. A maximum concentration value in the second sub-region is at most 20% larger than the reference value.

Abstract: A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Abstract: The current disclosure describes a p-type solar cell with back emitter with increased electrical efficiency and decreased manufacturing and material costs. According to one aspect of the present disclosure, the solar cell comprises gallium-doped silicon, closely arranged contact openings in the rear passivation layer, and physical vapor deposition application of at least one metal to create the rear contact. The front and rear contacts may be applied over a sputtered layer of transparent conducting oxide to increase transverse conductivity and permit smaller metal contacts, where desired. A plated layer of nickel or tin may be layered over the Physical Vapor Deposition-applied metal contact to create a stable, solderable surface while minimizing silver costs.

Abstract: A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Abstract: A solar cell includes a silicon substrate with a front-side and a rear-side; a dielectric layer structure on the rear-side of the silicon substrate, wherein the dielectric layer structure includes a plurality of through openings by means of which the rear-side of the silicon substrate is exposed; a printed Aluminum-containing metallization layer on the dielectric layer structure on the rear-side of the silicon substrate and at least partially in the through openings for electrically contacting the rear-side of the silicon substrate; wherein the Aluminum-containing metallization includes a lower layer thickness in a first area than in a second area, or the first area is free from the Aluminum-containing metallization; wherein at least one through opening of the plurality of through openings is at least partially disposed in the first area or borders on the first area or has a distance from the first area of less than 500 ?m.

Abstract: A solar cell array is made of a plurality of bifacial PERC solar cells, respectively formed in a semiconductor body, which are electrically interconnected by way of cell connectors. A structured passivation layer is applied on the rear-side surface of the semiconductor body, on which the current collecting rails and contact finger contacting the semiconductor body are provided. A respective cell connector extends at least partially along a longitudinal direction of at least one current collecting rail and electrically contacts this on at least one solder contact via a solder joint. A lateral width of a current collecting rail is at least partially greater than a lateral width of the cell connector covering this current collecting rail.

Abstract: In different exemplary embodiments, a solar cell is provided, including: a substrate with a first region and a second region, wherein the first region includes at least a first electrical conductivity and the second region includes at least a second electrical conductivity which is greater than the first electrical conductivity; and a passivation on the surface of the substrate; and a contact-structure on the surface of the substrate, wherein the contact-structure includes a plurality of contacts; wherein two contacts of the plurality of contacts are disposed at a first distance with respect to each other in the first region; wherein two further contacts of the plurality of contacts are disposed at a second distance with respect to each other in the second region; and wherein the second distance is greater than the first distance.

Abstract: The invention relates to bifacial solar cells and a photovoltaic module comprising several bifacial solar cells and an electrical connecting structure, through which the solar cells are electrically connected. The solar cells are configured rectangular with an aspect ratio different from one. The solar cells have a first contact grid with first contact elements on a first side and a second contact grid with second contact elements on a second side opposite the first side. The electrical connecting structure has wire guides connected to the first and second contact elements of the solar cells. The invention further relates to a process for manufacturing a photovoltaic module.

Abstract: A solar cell with a semiconductor body and with a contact layout for electrically connecting a surface of the semiconductor body, including: a plurality of current collecting contact fingers, which are disposed substantially parallel to each other, wherein the contact finger respectively has a line resistance of at least 100 ?/m, a plurality of busbars, which are electrically connected to the contact fingers, and at least one cell connector continuously connecting the busbar, wherein the contact fingers and the busbar are dimensioned, particularly in terms of the material properties thereof, layout on the semiconductor body thereof, width and layer thickness thereof, that the contact layout has a series resistance of maximum 1 ?cm2.

Abstract: In various embodiments, a solar cell includes: a substrate with a light incidence side and a rear side and a dielectric layer on the back of the substrate. The dielectric layer includes openings, which extend through the dielectric layer towards the back of the substrate. The solar cell further includes a plurality of metal contacts which are configured in the openings; and a metal structure which is configured on the dielectric layer. The metal structure includes contact areas which are connected to the metal contacts in an electrically conducting manner. The metal structure is structured such that the dielectric layer is at least partially exposed around the metal contacts.

Abstract: In different exemplary embodiments, a solar cell is provided, including: a substrate with a first region and a second region, wherein the first region includes at least a first electrical conductivity and the second region includes at least a second electrical conductivity which is greater than the first electrical conductivity; and a passivation on the surface of the substrate; and a contact-structure on the surface of the substrate, wherein the contact-structure includes a plurality of contacts; wherein two contacts of the plurality of contacts are disposed at a first distance with respect to each other in the first region; wherein two further contacts of the plurality of contacts are disposed at a second distance with respect to each other in the second region; and wherein the second distance is greater than the first distance.

Abstract: The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.

Abstract: A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Abstract: A semiconductor component, in particular in the form of a solar cell, comprises a two-dimensional semiconductor substrate with a first side, a second side which is arranged opposite thereto, a surface normal which is perpendicular to said first and second sides, and a plurality of recesses which are at least arranged on the second side and extend in the direction of the surface normal, at least one dielectric passivation layer which is arranged on the second side, an electrically conducting contact layer arranged on the passivation layer, a plurality of contact elements for electrically connecting the contact layer with the semiconductor substrate, which contact elements are electrically conductive, are in electrically conducting connection with both the semiconductor substrate and with the contact layer, fill at least 50%, in particular at least 90%, preferably 100% of in each case one of the recesses, project beyond the recesses with a projection in the direction perpendicular to the surface normal and are

Abstract: In various embodiments, a solar cell is provided. The solar cell may include a base region doped with dopant of a first doping type; an emitter region doped with dopant of a second doping type, wherein the second doping type is opposite to the first doping type; a plurality of regions in the emitter region having an increased dopant concentration of the second doping type compared with the emitter region; and a plurality of metallic soldering pads, wherein each soldering pad is at least partially arranged on a region having an increased dopant concentration.

Abstract: In various embodiments, a method for producing a solar cell is provided. In accordance with the method, through-holes may be formed in a solar cell substrate having the basic doping of a first conduction type. Furthermore, predetermined surface regions of a first surface of the solar cell substrate which include at least one portion of the through-holes may be highly doped with a second, opposite conduction type; and simultaneously or subsequently other surface regions of the first surface are lightly doped with the second conduction type. Furthermore, first and second metallic contacts may subsequently be formed in such a way that the second metallic contacts are electrically isolated from the first metallic contacts.

Abstract: The present invention relates to a photovoltaic component comprising a superimposed arrangement of at least one inorganic solar cell and at least one organic solar cell. The inorganic solar cell comprises a translucent backside opposite to the organic solar cell. The present invention further relates to a method of producing a photovoltaic component.

Abstract: Method for producing semiconductor components with a contact structure having a high aspect ratio comprising the following steps: providing an essentially plane semiconductor substrate having a first side and a second side, applying a mask onto at least a first partial area on at least one of the sides of the semiconductor substrate and applying a contact structure onto at least a second partial area, which is different from first partial area, on at least one of the sides of semiconductor substrate.

Abstract: A method for the production of a contact structure of a solar cell allows p-contacts and n-contacts to be produced simultaneously.

Abstract: An emitter wrap-through solar cell may include a semiconductor substrate having a first side, and a second side opposite the first side, contact structures having at least one emitter contact, and at least one base contact, wherein both the at least one emitter contact and the at least one base contact are arranged on the second side of the semiconductor substrate, and the contact structures have a metallization having nickel silicide.