Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for operating a projection exposure tool for microlithography is provided. The projection exposure tool includes an optical system which includes a number of optical elements which, during an imaging process, convey electromagnetic radiation. All of the surfaces of the optical elements interact with the electromagnetic radiation during the imaging process to form an overall optical surface of the optical system.

Abstract: The invention relates to an apparatus for determining a layer thickness on a tape moved along a feed direction, comprising: a movement unit for moving the tape along the feed direction, a light generating unit for generating illumination radiation, a beam shaping unit disposed downstream of the light generating unit for shaping at least one strip-shaped illumination beam for linear illumination of the tape transversely with respect to the feed direction, a detector unit for detecting illumination radiation reflected and/or transmitted at the tape, and an evaluation device for determining the layer thickness on the basis of the detected illumination radiation. The apparatus can also be used for determining a degree of contamination of a surface of the tape, the surface being contaminated by particles, by detecting illumination radiation scattered at the tape.

Abstract: The invention relates to an apparatus for determining a layer thickness on a tape moved along a feed direction, comprising: a movement unit for moving the tape along the feed direction, a light generating unit for generating illumination radiation, a beam shaping unit disposed downstream of the light generating unit for shaping at least one strip-shaped illumination beam for linear illumination of the tape transversely with respect to the feed direction, a detector unit for detecting illumination radiation reflected and/or transmitted at the tape, and an evaluation device for determining the layer thickness on the basis of the detected illumination radiation. The apparatus can also be used for determining a degree of contamination of a surface of the tape, the surface being contaminated by particles, by detecting illumination radiation scattered at the tape.

Abstract: A method of determining a shape of an optical test surface (14) includes: with adaptation optics (20), adapting a wavefront of a measuring beam (30) to a desired shape of the optical test surface (14), interferometrically measuring the shape of the optical test surface (14) with the adapted measuring beam, irradiating the adapted measuring beam at different angles of incidence onto the optical test surface and respectively measuring the wavefront of the measuring beam after the interaction of the measuring beam with the optical test surface (14), establishing the effect of the adaptation optics (20) upon the interferometric measurement result from the wavefronts measured for the individual angles of incidence, and determining the shape of the optical test surface (14) by removing the established effect of the adaptation optics (20) from the interferometric measurement result.

Abstract: Measuring a shape of an optical surface (14) of a test object (12) includes: providing an interferometric measuring device (16) generating a measurement wave (18); arranging the measuring device (16) and the test object (12) consecutively at different measurement positions relative to each other, such that different regions (20) of the optical surface (14) are illuminated by the measurement wave (18); measuring positional coordinates of the measuring device (16) at the different measurement positions in relation to the test object (12); obtaining surface region measurements by interferometrically measuring the wavefront of the measurement wave (18) after interaction with the respective region (20) of the optical surface (14) using the measuring device (16) in each of the measurement positions; and determining the actual shape of the optical surface (14) by computationally combining the sub-surface measurements based on the measured positional coordinates of the measuring device (16) at each of the measurement

Abstract: Measuring a shape of an optical surface (14) of a test object (12) includes: providing an interferometric measuring device (16) generating a measurement wave (18); arranging the measuring device (16) and the test object (12) consecutively at different measurement positions relative to each other, such that different regions (20) of the optical surface (14) are illuminated by the measurement wave (18); measuring positional coordinates of the measuring device (16) at the different measurement positions in relation to the test object (12); obtaining surface region measurements by interferometrically measuring the wavefront of the measurement wave (18) after interaction with the respective region (20) of the optical surface (14) using the measuring device (16) in each of the measurement positions; and determining the actual shape of the optical surface (14) by computationally combining the surface region measurements based on the measured positional coordinates of the measuring device (16) at each of the measurem

Abstract: A method of measuring a deviation of an optical surface from a target shape and a method of manufacturing an optical element. This method of measuring the deviation includes: performing a first interferometric measurement using a first diffractive measurement structure, which is arranged to cover a first area of the optical surface, to provide a first interferometric measurement result, performing a second interferometric measurement using a second diffractive measurement structure, which is arranged to cover a second area of the optical surface different from the first area, to provide a second interferometric measurement result, and determining a deviation of the optical surface from the target shape.

Abstract: A method for operating a projection exposure tool for microlithography is provided. The projection exposure tool includes an optical system which includes a number of optical elements which, during an imaging process, convey electromagnetic radiation. All of the surfaces of the optical elements interact with the electromagnetic radiation during the imaging process to form an overall optical surface of the optical system.

Abstract: A method of measuring a deviation of an optical surface from a target shape and a method of manufacturing an optical element. The method of measuring the deviation includes:—performing a first interferometric measurement using a first diffractive measurement structure, which is arranged to cover a first area of the optical surface, to provide a first interferometric measurement result,—performing a second interferometric measurement using a second diffractive measurement structure, which is arranged to cover a second area of the optical surface different from the first area, to provide a second interferometric measurement result, and—determining a deviation of the optical surface from the target shape.

Abstract: A method of determining a shape of an optical test surface (14) comprises the steps: adapting a wavefront of a measuring beam (30) to a desired shape of the optical test surface (14) by means of adaptation optics (20) and interferometric measurement of the shape of the optical test surface (14) by means of the adapted measuring beam, irradiating the adapted measuring beam at different angles of incidence onto the optical test surface and respectively measuring the wavefront of the measuring beam after the interaction of the latter with the optical test surface (14), establishing the effect of the adaptation optics (20) upon the interferometric measurement result from the wavefronts measured for the individual angles of incidence, and determining the shape of the optical test surface (14) by removing the established effect of the adaptation optics (20) from the interferometric measurement result.

Abstract: A method of measuring a deviation of an optical test surface from a target shape is provided. The method includes directing an incoming beam of electromagnetic radiation onto the test surface to generate a measuring beam that has interacted with the test surface, causing the ray that has interacted with the test surface to pass through an interferometer on a deviated path, performing an interferometric measurement by superimposing a reference beam with the measuring beam to determine a wave front deviation of the measuring beam from the reference beam, determining a retrace error in the wave front deviation, and correcting the measured wave front deviation by eliminating the retrace error therefrom. The differences in aberrations accumulated by the ray having traveled on the deviated path from fictitious aberrations that would have been accumulated by a ray that had traveled on an undeviated path cause the retrace error.

Abstract: A method of aligning at least two wave shaping elements, a method of measuring a deviation of an optical surface from a target shape and a measuring apparatus for interferometrically measuring a deviation of an optical surface from a target shape.

Abstract: Methods and systems for measuring a surface of an object are provided, wherein portions of the surface of the object are interferometrically measured and data representing a shape of the surface of the object are obtained by stitching the measurement data corresponding to each portion together. For measuring the individual portions of the surface of the object a variable light shaping member is utilized preferably constructed by arranging two diffraction gratings in a beam path of measuring light and appropriately displacing the two diffraction gratings relative to each other depending on a target shape of a particular portion of the surface of the object.

Abstract: A method of aligning at least two wave shaping elements, a method of measuring a deviation of an optical surface from a target shape and a measuring apparatus for interferometrically measuring a deviation of an optical surface from a target shape.

Abstract: Optical element having an optical surface, which optical surface is adapted to a non-spherical target shape, such that a long wave variation of the actual shape of the optical surface with respect to the target shape is limited to a maximum value of 0.2 nm, wherein the long wave variation includes only oscillations having a spatial wavelength equal to or larger than a minimum spatial wavelength of 10 mm.

Abstract: A method of aligning at least two wave shaping elements, a method of measuring a deviation of an optical surface from a target shape and a measuring apparatus for interferometrically measuring a deviation of an optical surface from a target shape.