Patents by Inventor Bernd Ebersberger

Bernd Ebersberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices
    Patent number: 9385105
    Abstract: A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: July 5, 2016
    Assignee: Intel Deutschland GmbH
    Inventors: Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Sven Albers, Reinhard Golly, Philipp Riess, Bernd Ebersberger
  • SEMICONDUCTOR DEVICES
    Publication number: 20150028478
    Abstract: A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.
    Type: Application
    Filed: January 10, 2013
    Publication date: January 29, 2015
    Inventors: Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Sven Albers, Reinhard Golly, Philipp Riess, Bernd Ebersberger