Patents by Inventor Bernd-Guenter Sippel

Bernd-Guenter Sippel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10998656
    Abstract: An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: May 4, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Bernd-Guenter Sippel, Peter Zweigle, Helmut Deringer, Franco Zeleny, Uwe Katzenwadel, Jens Hoffmann
  • Publication number: 20200194912
    Abstract: An electrical assembly for a motor vehicle transmission includes a printed circuit board (PCB), at least two contact surfaces, at least two contact elements, and a potting compound. The PCB has a component side and the two contact surfaces are arranged on the component side. The contact elements are each electrically connected by a PCB-side first end portion to one of the contact surfaces. The potting compound is arranged on the component side of the PCB, and the contact elements are partly embedded therein. The potting compound directly contacts the contact surfaces and the PCB-side end portions of the contact elements and covers the same. The contact elements protrude from the potting compound by second end portions facing away from the PCB. The electrical assembly includes a chip protection frame that protrudes outward from the potting compound and forms contact chambers for the second end portions of the contact elements.
    Type: Application
    Filed: June 14, 2018
    Publication date: June 18, 2020
    Inventors: Bernd-Guenter Sippel, Peter Zweigle, Helmut Deringer, Franco Zeleny, Uwe Katzenwadel, Jens Hoffmann