Abstract: A method for operating a motor vehicle with a prime mover (1), a drive output (2), and a parking lock (4) is provided. The parking lock (4), in an engaged condition, blocks a shaft (3) coupled to the drive output (2) and, in a disengaged condition, releases the shaft (3). In order to disengage the parking lock (4), at least one coupling mass (6) is coupled to the shaft (3), which is coupled to the drive output (2), while increasing the moment of inertia effective at the shaft (3).

Abstract: The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminum and/or an aluminum alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

Abstract: The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.

Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.

Abstract: The invention relates to a method for producing a metalized substrate which consists at least partially, and preferably entirely, of aluminium and/or an aluminium alloy. A conductive paste is applied to at least some sections of a surface of said substrate; in a first firing phase, the conductive paste is exposed to a substantially continuously increasing firing temperature which is increased to a predefinable maximum firing temperature of less than approximately 660° C.; in a second firing phase, the conductive paste is substantially exposed to said predefinable maximum firing temperature for a predefinable time period; in a cooling phase, the conductive paste is cooled down; and in a post-treatment phase, a surface of the conductive paste is mechanically post-treated, preferably brushed.

Abstract: A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

Abstract: Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.

Abstract: The invention relates to a method of producing a vehicle interior lining, especially a dashboard having a carrier part and, attached to the carrier part, a gas bag module containing a gas bag carrier and a gas bag that has a folded package section. The gas bag, together with its package section, is placed into a gas bag receptacle that is formed on the gas bag carrier and that has an outlet opening for the gas bag. The outlet opening is at least partially closed in the area of the package section by a rigid part. An outside surface of the carrier part is foam-encapsulated with a plastic layer in a state in which the gas bag module is connected to the carrier part. Moreover, the invention relates to a vehicle interior lining.