Abstract: An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: An embodiment includes an optical transmitter. An optical transmitter may include a primary laser for transmitting a primary optical signal and a backup laser for transmitting a backup optical signal. The optical transmitter may further include a photonic integrated circuit (PIC). The PIC may include at least one input port configured to receive the primary optical signal from the primary laser and the backup optical signal from the backup laser. The PIC may also include at least one output port configured to receive each of the primary optical signal and the backup optical signal. The optical transmitter may be configured to activate the backup laser upon determining that the primary laser has failed or is failing.

Abstract: In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.

Abstract: An embodiment includes an optical transmitter. An optical transmitter may include a primary laser for transmitting a primary optical signal and a backup laser for transmitting a backup optical signal. The optical transmitter may further include a photonic integrated circuit (PIC). The PIC may include at least one input port configured to receive the primary optical signal from the primary laser and the backup optical signal from the backup laser. The PIC may also include at least one output port configured to receive each of the primary optical signal and the backup optical signal. The optical transmitter may be configured to activate the backup laser upon determining that the primary laser has failed or is failing.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: A transceiver system may include a laser and a silicon optical grating. The laser may be configured to emit a laser beam at an output of the laser. The laser beam may have a non-circular elliptical mode profile. The silicon grating may be configured to exhibit a mode profile having a shape corresponding to the non-circular elliptical mode profile of the laser beam.

Abstract: In an example, a coupled system includes a first waveguide, at least one second waveguide, and an interposer. The first waveguide has a silicon (Si) core having first refractive index n1 and a tapered end. The at least one second waveguide each has a silicon nitride (SiN) core having a second refractive index n2. The interposer includes a third waveguide having a third refractive index n3 and a coupler portion, where n1>n2>n3. The tapered end of the first waveguide is adiabatically coupled to a coupler portion of one of the at least one second waveguide. A tapered end of one of the at least one second waveguide is adiabatically coupled to the coupler portion of the third waveguide of the interposer. The third waveguide of the interposer has an optical mode size that is similar to the mode size of a standard single mode optical fiber.

Abstract: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Abstract: A system includes a surface coupled edge emitting laser that includes a core waveguide, a fan out region optically coupled to the core waveguide in a same layer of the surface coupled edge emitting laser as the core waveguide; and a first surface grating formed in the fan out region; and a photonic integrated circuit (PIC) that includes an optical waveguide and a second surface grating formed in an upper layer of the PIC, wherein the second surface grating is in optical alignment with the first surface grating.

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

Abstract: In an example, a coupled system includes a first waveguide, at least one second waveguide, and an interposer. The first waveguide has a silicon (Si) core having first refractive index n1 and a tapered end. The at least one second waveguide each has a silicon nitride (SiN) core having a second refractive index n2. The interposer includes a third waveguide having a third refractive index n3 and a coupler portion, where n1>n2>n3. The tapered end of the first waveguide is adiabatically coupled to a coupler portion of one of the at least one second waveguide. A tapered end of one of the at least one second waveguide is adiabatically coupled to the coupler portion of the third waveguide of the interposer. The third waveguide of the interposer has an optical mode size that is similar to the mode size of a standard single mode optical fiber.

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.