Abstract: An arrangement for the treatment of high-polymer articles with boiling acrylic acid or solutions thereof, particulary for use in the grafting of acrylic acid to previously irradiated high-polymer articles such as textiles and the like, has a vessel for accommodating an acrylic acid-containing bath. The arrangement further comprises at least one member which is provided with a copper surface, and the member is arranged in such a fashion that the copper surface is exposed to the interior of the vessel. The copper surface is free of direct contact with all metallic parts of the arrangement having a substantially different composition than this surface and, advantageously, this is effected by electrically insulating the copper surface or the member from the remainder of the arrangement. The insulation of the copper surface or the member from the metallic parts of the arrangement prevents corrosion effects which might occur by virtue of contact between dissimilar metals.