Abstract: A power converter arrangement includes semiconductor arrangements for two motors, wherein a control unit is used to continuously form a sum current composed of a first current and a second current and the sum current is compared with a predeterminable maximum value in order to protect the motors from being destroyed, where the control unit includes a device in which a priority grade is input by a user, where the priority grade describes the priority of one of the two machines, and where the control unit reduces the current of the respective machine that lacks priority according to the priority grade when the maximum value is exceeded.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Abstract: The invention relates to a housing (1) for an electrical appliance (20) comprising a housing body (2) which at least partially houses an electrical component (3) of the electrical appliance (20), the housing body (2) having at least one support point (4) for being supported on a plate (5) to which the electrical component (3) is connected, the housing (1) also having at least one temperature sensor (6) for sensing the temperature of the plate (5), each temperature sensor (6) being arranged in the housing body (2) in the region of a support point (4). The invention also relates to an electrical appliance (20) comprising at least one electrical component (3), at least one plate (5), which is connected in each case to the electrical component (3), and at least one housing (1) of the aforementioned kind, the housing body (2) being supported at the support point (4) on the plate (5).

Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Abstract: A structured metal layer in contact with an electronic component is applied on an upper side of a substrate of electrically insulating material. A metallic contact layer is applied to an underside of the substrate, with the underside configured as planar surface in a state of the substrate that is free of mechanical stress. The contact layer is connected to a metallic base plate via an intermediate layer. The contact layer is connected to the metallic base plate at an elevated temperature. The semiconductor module is then cooled. The side of the metallic base plate facing the substrate and the side of the metallic base plate facing away from the substrate are configured as planar surfaces in a state of the base plate that is free of mechanical stress. Upon cooling of the semiconductor module, the base plate forms a concave curvature on its side facing away from the substrate.

Abstract: A structured metal layer in contact with an electronic component is applied on an upper side of a substrate of electrically insulating material. A metallic contact layer is applied to an underside of the substrate, with the underside configured as planar surface in a state of the substrate that is free of mechanical stress. The contact layer is connected to a metallic base plate via an intermediate layer. The contact layer is connected to the metallic base plate at an elevated temperature. The semiconductor module is then cooled. The side of the metallic base plate facing the substrate and the side of the metallic base plate facing away from the substrate are configured as planar surfaces in a state of the base plate that is free of mechanical stress. Upon cooling of the semiconductor module, the base plate forms a concave curvature on its side facing away from the substrate.

Abstract: A converter filter includes an inductor having a main winding and a winding element, and first and second absorption circuits coupled to the inductor. The first and second absorption circuits are decoupled from one another by an inductance of the winding element of the inductor. An auxiliary winding is coupled to the inductor and forms a 1:1 transformer with the winding element. The auxiliary winding is fed via the inductance of the winding element. The auxiliary winding and the second absorption circuit are each connected to an output of the winding element and the first absorption circuit is connected to the auxiliary winding.

Abstract: A converter filter includes an inductor having a main winding and a winding element, and first and second absorption circuits coupled to the inductor. The first and second absorption circuits are decoupled from one another by an inductance of the winding element of the inductor. An auxiliary winding is coupled to the inductor and forms a 1:1 transformer with the winding element. The auxiliary winding is fed via the inductance of the winding element. The auxiliary winding and the second absorption circuit are each connected to an output of the winding element and the first absorption circuit is connected to the auxiliary winding.

Abstract: Various designs of configurable multiswitch or multifeed satellite reception systems comprising switch-over matrices and transponder branches and “one cable solutions” which allow or do not allow subsequent expansion with respect to the subscribers that can be connected thereto are known from the prior art. In general, the costs for such systems comprising frequency converters are primarily determined by the frequency converters and the associated filters. The aim of the invention is to devise inexpensive methods or devices which allow detection of the complete frequency spectrum—even after subsequent expansions—and which therefore do not involve any restrictions with respect to the program range.

Abstract: Various designs of configurable multiswitch or multifeed satellite reception systems comprising switch-over matrices and transponder branches and “one cable solutions” which allow or do not allow subsequent expansion with respect to the subscribers that can be connected thereto are known from the prior art. In general, the costs for such systems comprising frequency converters are primarily determined by the frequency converters and the associated filters. The aim of the invention is to devise inexpensive methods or devices which allow detection of the complete frequency spectrum—even after subsequent expansions—and which therefore do not involve any restrictions with respect to the program range.