Abstract: A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.

Abstract: A semiconductor assembly includes semiconductor elements connected to a first conductor track of a substrate. A current path impedance is embodied from each semiconductor element to a connection element. A first bond connector connects a contact surface on a substrate-distal side of each semiconductor element to a second conductor track of the substrate. Electrically conductive parallel connections transverse to a current direction connect the second conductor track to a third conductor track of the substrate. The third conductor track is connected to the connection element. The electrically conductive connections are dimensioned and/or arranged to substantially balance the current path impedances of the current paths from the semiconductor elements to the connection element. A second bond connector connects the third conductor track to the connection element. The second and third conductor tracks of the substrate each have a measurement tap to detect a current through the electrically conductive connections.

Abstract: A semiconductor arrangement includes a substrate, a semiconductor element connected to the substrate and including on a side remote from the substrate a contact surface which is connected to the substrate via a first bond connecting means such that as to form on the contact surface a stitch contact arranged between a first loop and a second loop of the first bond connecting means. The first loop has a first maximum and the second loop has a second maximum. A second bond connecting means has a first transverse arranged to run above the first stitch contact and, viewed running parallel to the contact surface, between the first maximum of the first loop and the second maximum of the second loop. The first transverse loop of the second bond connecting means is arranged to run below the first maximum of the first loop and/or the second maximum of the second loop.

Abstract: A drive system having a plurality of drive units that each have a converter and preferably one motor, wherein the drive system includes an energy supply system that supplies electric energy to the drive units, and a control system that includes a control computer and at least one control line, where the control system transmits control instructions to the drive units, and where the energy supply system and the drive units are releasably connected together via a first respective connection connector, preferably via a plug connection, and the control system and the drive units are releasably connected together via a second respective connection connector, preferably via a plug connection.

Abstract: A semiconductor arrangement includes a substrate, a semiconductor element connected to the substrate and including on a side remote from the substrate a contact surface which is connected to the substrate via a first bond connecting means such that as to form on the contact surface a stitch contact arranged between a first loop and a second loop of the first bond connecting means. The first loop has a first maximum and the second loop has a second maximum. A second bond connecting means has a first transverse arranged to run above the first stitch contact and, viewed running parallel to the contact surface, between the first maximum of the first loop and the second maximum of the second loop. The first transverse loop of the second bond connecting means is arranged to run below the first maximum of the first loop and/or the second maximum of the second loop.

Abstract: A power converter arrangement includes semiconductor arrangements for two motors, wherein a control unit is used to continuously form a sum current composed of a first current and a second current and the sum current is compared with a predeterminable maximum value in order to protect the motors from being destroyed, where the control unit includes a device in which a priority grade is input by a user, where the priority grade describes the priority of one of the two machines, and where the control unit reduces the current of the respective machine that lacks priority according to the priority grade when the maximum value is exceeded.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Abstract: The invention relates to a housing (1) for an electrical appliance (20) comprising a housing body (2) which at least partially houses an electrical component (3) of the electrical appliance (20), the housing body (2) having at least one support point (4) for being supported on a plate (5) to which the electrical component (3) is connected, the housing (1) also having at least one temperature sensor (6) for sensing the temperature of the plate (5), each temperature sensor (6) being arranged in the housing body (2) in the region of a support point (4). The invention also relates to an electrical appliance (20) comprising at least one electrical component (3), at least one plate (5), which is connected in each case to the electrical component (3), and at least one housing (1) of the aforementioned kind, the housing body (2) being supported at the support point (4) on the plate (5).

Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Abstract: A structured metal layer in contact with an electronic component is applied on an upper side of a substrate of electrically insulating material. A metallic contact layer is applied to an underside of the substrate, with the underside configured as planar surface in a state of the substrate that is free of mechanical stress. The contact layer is connected to a metallic base plate via an intermediate layer. The contact layer is connected to the metallic base plate at an elevated temperature. The semiconductor module is then cooled. The side of the metallic base plate facing the substrate and the side of the metallic base plate facing away from the substrate are configured as planar surfaces in a state of the base plate that is free of mechanical stress. Upon cooling of the semiconductor module, the base plate forms a concave curvature on its side facing away from the substrate.

Abstract: A structured metal layer in contact with an electronic component is applied on an upper side of a substrate of electrically insulating material. A metallic contact layer is applied to an underside of the substrate, with the underside configured as planar surface in a state of the substrate that is free of mechanical stress. The contact layer is connected to a metallic base plate via an intermediate layer. The contact layer is connected to the metallic base plate at an elevated temperature. The semiconductor module is then cooled. The side of the metallic base plate facing the substrate and the side of the metallic base plate facing away from the substrate are configured as planar surfaces in a state of the base plate that is free of mechanical stress. Upon cooling of the semiconductor module, the base plate forms a concave curvature on its side facing away from the substrate.

Abstract: A converter filter includes an inductor having a main winding and a winding element, and first and second absorption circuits coupled to the inductor. The first and second absorption circuits are decoupled from one another by an inductance of the winding element of the inductor. An auxiliary winding is coupled to the inductor and forms a 1:1 transformer with the winding element. The auxiliary winding is fed via the inductance of the winding element. The auxiliary winding and the second absorption circuit are each connected to an output of the winding element and the first absorption circuit is connected to the auxiliary winding.

Abstract: A converter filter includes an inductor having a main winding and a winding element, and first and second absorption circuits coupled to the inductor. The first and second absorption circuits are decoupled from one another by an inductance of the winding element of the inductor. An auxiliary winding is coupled to the inductor and forms a 1:1 transformer with the winding element. The auxiliary winding is fed via the inductance of the winding element. The auxiliary winding and the second absorption circuit are each connected to an output of the winding element and the first absorption circuit is connected to the auxiliary winding.

Abstract: Various designs of configurable multiswitch or multifeed satellite reception systems comprising switch-over matrices and transponder branches and “one cable solutions” which allow or do not allow subsequent expansion with respect to the subscribers that can be connected thereto are known from the prior art. In general, the costs for such systems comprising frequency converters are primarily determined by the frequency converters and the associated filters. The aim of the invention is to devise inexpensive methods or devices which allow detection of the complete frequency spectrum—even after subsequent expansions—and which therefore do not involve any restrictions with respect to the program range.

Abstract: Various designs of configurable multiswitch or multifeed satellite reception systems comprising switch-over matrices and transponder branches and “one cable solutions” which allow or do not allow subsequent expansion with respect to the subscribers that can be connected thereto are known from the prior art. In general, the costs for such systems comprising frequency converters are primarily determined by the frequency converters and the associated filters. The aim of the invention is to devise inexpensive methods or devices which allow detection of the complete frequency spectrum—even after subsequent expansions—and which therefore do not involve any restrictions with respect to the program range.

Abstract: A digital encoding process for transmitting and/or storing acoustical sigs and, in particular, music signals, in which scanned values of the acoustical signal are transformed by means of a transformation or a filter bank into a sequence of second scanned values, which reproduce the spectral composition of the acoustical signal, and the sequence of second scanned values is quantized in accordance with the requirements with varying precision and is partially or entirely encoded by an optimum encoder, and in which a corresponding decoding and inverse transformation takes place during the reproduction. An encoder is utilized in a manner in which the occurrence probability of the quantized spectral coefficient is correlated to the length of the code in such a way that the more frequently the spectral coefficient occurs, the shorter the code word.