Abstract: A method for marking a substrate with a unique library of nucleic acid sequence tags includes providing a library of nucleic acid sequence tags, including at least two different groups of nucleic acid sequence tags that each include multiple nucleic acid sequence tags. Each nucleic acid sequence tags has a defined nucleic acid motif in at least a first and a second characteristic position, and outside of characteristic positions a random nucleic acid sequence is present. The combination of the nucleic acid motifs of the at least first characteristic position and the at least second characteristic position of a nucleic acid sequence tag is characteristic and unique for the group of nucleic acid sequence tags. The substrate is marked with the unique nucleic acid library by applying the nucleic acid sequence tag library. A packaging article and different kits for applying and validating a substrate tagged are also provided.

Abstract: Various embodiments of the teachings herein include a method for monitoring a flux application in a soldering process. An example includes: defining flux wetting surfaces in relation to an image of an application surface; generating a thermographic recording of the application surface selectively provided with liquid flux; defining adjustment points on the application surface which can be identified on the image and on the thermographic recording; superimposing the image and the thermographic recording on the basis of the adjustment points; and comparing the position of temperature anomalies on the application surface identified by the thermographic recording with the position of the flux wetting surfaces on the image.

Abstract: Various embodiments of the teachings herein include a method for operating an electronics production line for producing electronic assemblies. The electronics production line comprises a device to apply joining material onto component carriers, an assembly device to place electronic components onto the component carriers, a joining device to join the electronic components to the component carriers, and a transport to transport the component carriers through the production line. An example method includes: transporting a process parameter acquisition system through the electronics production line on the transport; measuring actual process parameter values with the process parameter acquisition system; providing setpoint process parameter values; determining any deviations between actual and setpoint process parameter values; and providing a dataset including the deviations.

Abstract: Various embodiments of the teachings herein include methods for recording and evaluating parameter values in an electronics production line to produce electronic assemblies, the production line including a dispenser for applying joining material to a component carrier, a placement device for placing electronic components on the component carrier, and a joining device to join the electronic components to the component carrier. An example method includes: receiving a parameter value from each of the devices; and storing the parameter values in a dataset associated with a defined number of component carrier and with the resulting assemblies.

Abstract: Various embodiments of the teachings herein include power electronics assemblies. An example assembly includes: a substrate with a metallization forming first and second structures separated from each other by interspaces and with thickness of at least 300 ?m; a power semiconductor mounted on the first structure; and an electric insulator having a thermal conductivity of at least 50 W/mK arranged at least sectionally in such a way that the structures adjacent to the respective interspace are thermally connected by the insulator.

Abstract: The invention relates to a moisture sensor (10) comprising an electromagnetically shielding sensor housing (1) and a microstrip (4) arranged therein as well as at least one coaxial cable (3, 5) each having an inner conductor (3A, 5A) electrically connected to the microstrip (4) and an outer conductor (3B, 5B) electrically connected to the sensor housing (1), wherein the microstrip (4) and the at least one coaxial cable (3, 5) are arranged to conduct microwaves with a frequency (f) in a frequency band (?f) which covers at least part of the microwave range of between 10 megahertz (MHz) and 300 gigahertz (GHz), the sensor housing (1) is configured as a cavity resonator with a resonant frequency (fR1, fR2, fR3) within the frequency band (?f) and shielding for the frequency band (?f) and has openings (2) which establish a hygric contact between the interior and the environment (U) of the sensor housing (1) that is sufficient for moisture equalization, and wherein moisture-storing material is provided in the interi

Abstract: The present invention relates to an insufflator having an insufflation tube comprising an integrated heating element and humidifying material for laparoscopy, wherein measurement of the moisture content is possible. No separate humidity sensor is required to measure the moisture content of the humidifying material. Components that are already part of the insufflation tube can be used, in particular, the lead wires of heating elements or temperature sensors.

Abstract: Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.

Abstract: Various embodiments of the teachings herein include an apparatus comprising: a component; a cooling element; and a connecting element arranged between the component and the cooling element to thermally couple the cooling element to the component. The connecting element comprises a porous connecting body including a metal material. Pores of the connecting body are at least in part filled with a filling material including a low-melting alloy or a fluorinated organic liquid.

Abstract: Various embodiments of the teachings herein include a computer-implemented method for generating an identification data set for an electronic module having a substrate, a joint, and an electronic component. An example method includes: providing a digital and/or X-ray recording of at least a partial region of the module; and generating the identification data set based on at least a portion of the recording, the portion including the joint. The identification data set identifies at least one of a number, an arrangement, and/or a size of gas inclusions in the joint.

Abstract: A resource management system (39) manages a supply of resource material and/or resource items to a plurality of at least two additive manufacturing machines (3) for additive manufacturing. The resource management system (39) includes a control unit (41) that is configured to receive a signal indicative of a demand for resource material and/or resource items of any of the additive manufacturing machines (3). The control unit (41) is configured to schedule the supply of demanded resource material and/or resource items according to a predetermined prioritization scheme for resolving demand conflicts.

Abstract: Various embodiments of the teachings herein include a method for joining and insulating a power electronic semiconductor component with contact surfaces to a substrate. In some embodiments, the method includes: preparing the substrate with a metallization defining an installation slot having joining material, wherein the substrate comprises an organic or a ceramic wiring support; arranging an electrically insulating film and the semiconductor component on the substrate, such that the contact surfaces of the semiconductor component facing the substrate are omitted from the film and regions of the semiconductor component exposed by the contact surfaces are insulated at least in part by the film from the substrate and from the contact surfaces; and joining the semiconductor component to the substrate and electrically insulating the semiconductor component at least in part by the film in one step.

Abstract: A device for scattered light measurement of particles in a gas, comprising a light source, a beam splitter which splits a light beam emitted by the light source into a measuring beam and a reference beam, a light receiving device arranged at a distance from the beam splitter, which comprises at least one lens arranged in the reference beam with an optical axis aligned at an acute angle to the measuring beam, a first light receiver on the side of the lens facing away from the beam splitter, for receiving the scattered light imaged by the latter from a measurement volume in a gas-bearing region between the beam splitter and the lens, and a second light receiver on the side of the lens facing away from the beam splitter for receiving the reference beam imaged by the latter.

Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).

Abstract: The present disclosure relates to an insufflator with insufflation tube with integrated heating element and humidifier for laparoscopy, whereby measurement of the moisture content is possible.

Abstract: Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.

Abstract: Various embodiments include a method for installing an electronic assembly having a die and a substrate with a reference plane. The method may include: providing a product carrier having recesses with varying dimensions different from one another; and arranging planar molded parts, joining materials, and the die on the product carrier. The die is in electrical contact with at least one planar molded part and at least one joining material. The method further includes forming functional elements from the planar molded parts and/or the die and the joining materials, the functional elements supporting the substrate and electrically contacting the reference plane.

Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.

Abstract: Various embodiments include a power module comprising: a first power electronics device arranged on a first substrate board; and a second power electronics device mounted on a second substrate board. The first substrate board, the first device, the second substrate board, and the second device are arranged on a first baseplate stacked above one another or in planar fashion beside one another.

Abstract: Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.