Abstract: Preparation of optionally substituted dihydroisoquinolines. The present invention relates to a process for the preparation of optionally substituted dihydroi-soquinolines of the formula I.

Abstract: Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.

Abstract: Various embodiments of the teachings herein include an apparatus comprising: a component; a cooling element; and a connecting element arranged between the component and the cooling element to thermally couple the cooling element to the component. The connecting element comprises a porous connecting body including a metal material. Pores of the connecting body are at least in part filled with a filling material including a low-melting alloy or a fluorinated organic liquid.

Abstract: A prechamber spark plug, including center and ground electrodes, a housing having an external thread, a cap arranged on the housing and together with the housing defines a prechamber, and an insulator which electrically insulates the center electrode from the housing. The external thread has a thread length in the axial direction. The housing is fastened to the insulator at first and second fixing regions so that a first clamping force at the first fixing region acts from the housing on the insulator, and a second clamping force at the second fixing region acts from the housing on the insulator. The first and second clamping forces are directed in opposite directions to one another in the axial direction. A distance between the first and second fixing regions in the axial direction defines a clamping length. A ratio between the thread length and the clamping length is between 0.7 to 1.3.

Abstract: Various embodiments of the teachings herein include a computer-implemented method for generating an identification data set for an electronic module having a substrate, a joint, and an electronic component. An example method includes: providing a digital and/or X-ray recording of at least a partial region of the module; and generating the identification data set based on at least a portion of the recording, the portion including the joint. The identification data set identifies at least one of a number, an arrangement, and/or a size of gas inclusions in the joint.

Abstract: The present invention relates to fungicidal mixtures comprising at least one substituted pyridines (compounds I) and at least one active compound II in a weight ratio of from 100:1 to 1:100; to a method for controlling phytopathogenic harmful fungi using mixtures of at least one compound I and at least one compound II in a weight ratio of from 100:1 to 1:100; to the use of mixtures comprising compounds I and compounds II for controlling phytopathogenic harmful fungi; to agrochemical compositions comprising these mixtures; and to agrochemical compositions further comprising seed.

Abstract: A resource management system (39) manages a supply of resource material and/or resource items to a plurality of at least two additive manufacturing machines (3) for additive manufacturing. The resource management system (39) includes a control unit (41) that is configured to receive a signal indicative of a demand for resource material and/or resource items of any of the additive manufacturing machines (3). The control unit (41) is configured to schedule the supply of demanded resource material and/or resource items according to a predetermined prioritization scheme for resolving demand conflicts.

Abstract: A prechamber spark plug, including center and ground electrodes, a housing having an external thread, a cap arranged on the housing and together with the housing defines a prechamber, and an insulator which electrically insulates the center electrode from the housing. The external thread has a thread length in the axial direction. The housing is fastened to the insulator at first and second fixing regions so that a first clamping force at the first fixing region acts from the housing on the insulator, and a second clamping force at the second fixing region acts from the housing on the insulator. The first and second clamping forces are directed in opposite directions to one another in the axial direction. A distance between the first and second fixing regions in the axial direction defines a clamping length. A ratio between the thread length and the clamping length is between 0.7 to 1.3.

Abstract: The present invention relates to compounds of formula I wherein the variables are defined as given in the description and claims. The invention further relates to uses and composition for compounds of formula I.

Abstract: Various embodiments of the teachings herein include a method for joining and insulating a power electronic semiconductor component with contact surfaces to a substrate. In some embodiments, the method includes: preparing the substrate with a metallization defining an installation slot having joining material, wherein the substrate comprises an organic or a ceramic wiring support; arranging an electrically insulating film and the semiconductor component on the substrate, such that the contact surfaces of the semiconductor component facing the substrate are omitted from the film and regions of the semiconductor component exposed by the contact surfaces are insulated at least in part by the film from the substrate and from the contact surfaces; and joining the semiconductor component to the substrate and electrically insulating the semiconductor component at least in part by the film in one step.

Abstract: A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.

Abstract: The present invention relates the use of compounds of the formula I, or their N-oxides, or the agriculturally acceptable salts thereof, for combating phytopathogenic harmful fungi. Further the present invention relates to agrochemical compositions comprising at least one such compound of the formula I and to agrochemical compositions further comprising seeds.

Abstract: The present invention relates to a process for the preparation pyridine derivatives of the formula (I).

Abstract: A prechamber spark plug. The prechamber spark plug includes: a housing, and a cap which has at least one pass-through opening, the cap being situated at a combustion chamber-side end of the housing. The cap and the housing form a prechamber. An outer cap surface area of the cap, which faces away from the prechamber, has at least one predefined ratio to respectively one further geometric feature of the cap.

Abstract: The present invention relates to a process for the preparation of pyridine derivatives of the formula (I) comprising two steps, namely, a selective chlorination followed by a selective fluorination.

Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).

Abstract: The present disclosure relates to an insufflator with insufflation tube with integrated heating element and humidifier for laparoscopy, whereby measurement of the moisture content is possible.

Abstract: A turn-off device for a sensor, an actuator or a control unit for a vehicle or for an industrial facility, the sensor, the actuator or the control unit being connectable via a PHY interface to a communication network, via which the sensor, the actuator or the control unit is able to exchange messages with other units of the vehicle or of the industrial facility, the turn-off device including a blocker, which physically prevents the PHY interface from sending messages to the communication network. A sensor, an actuator or a control unit that includes the turn-off device, a method for functional checking, and an associated computer program are also described.

Abstract: Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.

Abstract: Various embodiments include a method for installing an electronic assembly having a die and a substrate with a reference plane. The method may include: providing a product carrier having recesses with varying dimensions different from one another; and arranging planar molded parts, joining materials, and the die on the product carrier. The die is in electrical contact with at least one planar molded part and at least one joining material. The method further includes forming functional elements from the planar molded parts and/or the die and the joining materials, the functional elements supporting the substrate and electrically contacting the reference plane.