Patents by Inventor Bernd Noehammer

Bernd Noehammer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for processing a semiconductor workpiece
    Patent number: 10157765
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel
  • METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
    Publication number: 20170076970
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Application
    Filed: November 23, 2016
    Publication date: March 16, 2017
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel
  • METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
    Publication number: 20150147850
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: Infineon Technologies AG
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel