Abstract: A system includes an encoder magnet, a magnetic field sensor, and a shield structure. The encoder magnet is configured to rotate about an axis of rotation and is configured to produce a measurement magnetic field. The magnetic field sensor is axially displaced away from the encoder magnet and is configured to detect the measurement magnetic field. The shield structure at least partially surrounds both of the encoder magnet and the magnetic field sensor for shielding against stray magnetic fields. The shield structure attaches to a secondary structure. The shield structure and the encoder magnet may be coupled via the secondary structure so that they are commonly rotational. Alternatively, the sensor package and the shield structure are coupled via the secondary structure so that they are nonrotational relative to the encoder magnet.

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

Abstract: A sensor assembly includes first and second sensor packages adjacent to one another and directly overmolded with an overmold material without being attached to a carrier structure. The first sensor package includes a first sensor die, a first set of connector pins electrically connected to the first sensor die, a first housing in which the first sensor die is located, the first housing having first and second surfaces spaced apart from one, and a first component positioned in proximity to the second surface of the first housing. The second sensor package includes a second sensor die, a second set of connector pins electrically connected to the second sensor die, a second housing in which the second sensor die is located, the second housing having third and fourth surfaces spaced apart from one another, and a second component positioned in proximity to the fourth surface of the second housing.

Abstract: A system includes an encoder magnet, a magnetic field sensor, and a shield structure. The encoder magnet is configured to rotate about an axis of rotation and is configured to produce a measurement magnetic field. The magnetic field sensor is axially displaced away from the encoder magnet and is configured to detect the measurement magnetic field. The shield structure at least partially surrounds both of the encoder magnet and the magnetic field sensor for shielding against stray magnetic fields. The shield structure attaches to a secondary structure. The shield structure and the encoder magnet may be coupled via the secondary structure so that they are commonly rotational. Alternatively, the sensor package and the shield structure are coupled via the secondary structure so that they are nonrotational relative to the encoder magnet.

Abstract: A sensor assembly includes first and second sensor packages adjacent to one another and directly overmolded with an overmold material without being attached to a carrier structure. The first sensor package includes a first sensor die, a first set of connector pins electrically connected to the first sensor die, a first housing in which the first sensor die is located, the first housing having first and second surfaces spaced apart from one, and a first component positioned in proximity to the second surface of the first housing. The second sensor package includes a second sensor die, a second set of connector pins electrically connected to the second sensor die, a second housing in which the second sensor die is located, the second housing having third and fourth surfaces spaced apart from one another, and a second component positioned in proximity to the fourth surface of the second housing.

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Abstract: A sensor package includes a sensor die, connector pins connected to the sensor die, and a housing in which the sensor die is located. The housing has first and second surfaces spaced apart from one another by first, second, third, and fourth sidewalls. The connector pins extend from the first sidewall, and the housing includes a notch region extending into the first surface of the housing such that a material portion of the housing is absent at the first sidewall and at the first surface of the housing. A method for forming a sensor assembly includes retaining the sensor package in a cavity of a mold tool by receiving an alignment bar of an alignment tool in the notch region and performing an overmolding process to fill the cavity with an overmold material. The alignment bar is configured to hold the sensor package in the mold tool during overmolding.

Abstract: A sensor package includes a magnetic field sensor having first and second surfaces, the first surface being a sensing surface of the magnetic field sensor, a shield structure spaced apart from the magnetic field sensor, and a spacer interposed between the magnetic field sensor and the shield structure. The shield structure is configured to suppress stray magnetic fields in a plane parallel to first and second axes that are parallel to the sensing surface of the magnetic field sensor and perpendicular to one another. The shield structure may include a continuous sidewall having a central region, the spacer being surrounded by the continuous sidewall and the sensing surface of the magnetic field sensor being positioned outside of the central region. A system includes an encoder magnet and the sensor package, with the sensing surface of the magnetic field sensor facing the encoder magnet.

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Abstract: A sensor package includes a lead frame, a sensor component, and first and second capacitors. The lead frame has a sensor mounting area and first and second leads. The sensor mounting area, the first lead, and the second lead are characterized by a first side and a second side. The sensor component is attached to the first side of the sensor mounting area of the lead frame. The first capacitor is interconnected between the first and second leads, with the first capacitor being attached to the first side of each of the leads. The second capacitor is interconnected between the first and second leads, with the second capacitor being attached to the second side of each of the leads. The first and second capacitors are arranged in stacked relation with one another on opposing sides of the leads, and the sensor component and capacitors are located in a single housing.

Abstract: A sensor package includes a lead frame, a sensor component, and first and second capacitors. The lead frame has a sensor mounting area and first and second leads. The sensor mounting area, the first lead, and the second lead are characterized by a first side and a second side. The sensor component is attached to the first side of the sensor mounting area of the lead frame. The first capacitor is interconnected between the first and second leads, with the first capacitor being attached to the first side of each of the leads. The second capacitor is interconnected between the first and second leads, with the second capacitor being attached to the second side of each of the leads. The first and second capacitors are arranged in stacked relation with one another on opposing sides of the leads, and the sensor component and capacitors are located in a single housing.

Abstract: A sensor package is provided. The sensor package comprises a first lead comprising a first anchoring area configured to anchor the first lead to a package body; a second lead comprising a second anchoring area configured to anchor the second lead to the package body; a sensor component; and a capacitor coupled between the first and second anchoring areas.

Abstract: A surface-mounted device comprising a semiconductor chip (5) encapsulated in a package (1) and leads (2) projecting from the package so as to bring the semiconductor chip into contact with a substrate (3), which leads are provided at their surface, at the location of one of the pads provided for surface mounting, with a three-dimensional contact pattern.