Abstract: The invention relates to a test head for a finger tester for testing printed circuit boards, a finger tester and a method for testing printed circuit boards. The test head comprises a slide, which can be movably arranged on a traverse of the finger tester, a holding module for holding a swivel arm, which is formed at the free end remote from the holding module for receiving a test probe, a lifting device, by means of which the holding module is formed to be movable in the vertical direction relative to the slide, the lifting device comprising a vertical guide rail with a rolling bearing, and a swivel device for rotating the holding module and thus the pivoting arm about a vertical axis of rotation, wherein the swivel device comprises a motor for rotating the swivel device.

Abstract: The invention relates to a test head for a finger tester for testing printed circuit boards, a finger tester and a method for testing printed circuit boards. The test head comprises a slide, which can be movably arranged on a traverse of the finger tester, a holding module for holding a swivel arm, which is formed at the free end remote from the holding module for receiving a test probe, a lifting device, by means of which the holding module is formed to be movable in the vertical direction relative to the slide, the lifting device comprising a vertical guide rail with a rolling bearing, and a swivel device for rotating the holding module and thus the pivoting arm about a vertical axis of rotation, wherein the swivel device comprises a motor for rotating the swivel device.

Abstract: A probe for a circuit board tester as well as to an adapter and a circuit board tester. The probe comprises a needle and a sleeve, the needle being shiftingly guided in the sleeve and the needle protruding at least 10 mm from the sleeve, more particularly more than 20 mm. In one embodiment, the needle is conically tapered to a contact tip at least in a portion protruding from the sleeve. With the probe in accordance with the invention, adapters for circuit boards can be produced comprising contacts in high-density, the probes simultaneously acting resiliently.

Abstract: The test needle has, for contacting a circuit board test point, a contact portion configured conically tapered to a free contact tip. The contact portion has a length of at least 15 mm and at the contact tip a diameter smaller than 0.2 mm. An end section of the contact portion apposite the contact tip comprises a diameter at least 0.1 mm larger than the contact tip. With the test needle in accordance with the invention, extremely dense structures on circuit boards can be strobed. The test needle in accordance with the invention is stiffer than known test needles for strobing comparable structures. This simplifies their handling and the configuration of a pattern adapter incorporating these test needles.

Abstract: The test needle comprises, for contacting a circuit board test point, a contact portion configured conically tapered to a free contact tip. The contact portion has a length of at least 15 mm and at the contact tip a diameter smaller than 0.2 mm. An end section of the contact portion opposite the contact tip comprises a diameter at least 0.1 mm larger than the contact tip. With the test needle in accordance with the invention extremely dense structures on circuit boards can be strobed. The test needle in accordance with the invention is stiffer than known test needles for strobing comparable structures. This simplifies their handling and the configuration of a pattern adapter incorporating these test needles.

Abstract: A probe for a circuit board tester as well as to an adapter and a circuit board tester. The probe comprises a needle and a sleeve, the needle being shiflingly guided in the sleeve and the needle protruding at least 10 mm from the sleeve, more particularly more than 20 mm. In one embodiment, the needle is conically tapered to a contact tip at least in a portion protruding from the sleeve. With the probe in accordance with the invention, adapters for circuit boards can be produced comprising contacts in high-density, the probes simultaneously acting resiliently.