Abstract: A multi-emitter solid state lighting device includes at least one narrow spectral output solid state light emitter, such as may be in the green range, having a full width-half maximum emission value of no greater than 30 nm. First, second, and third electrically solid state emitters may include dominant wavelengths in the ranges of 485-505 nm (or 491-505 nm), 526-545 nm, and 615-625 nm. Aggregate emissions of a solid state lighting device may comprise a scotopic/photopic (S/P) ratio value that exceeds threshold values for conventional white light-emitting devices including at least one phosphor-converted LED by at least 10%, 20%, 30%, or 40%, in combination with reasonably high gamut and brightness, over a range of desired CCT values.

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.

Abstract: A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.

Abstract: An LED component includes, according to a first embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an optical lens overlying the LED chips and having a lens base attached to the substrate, where the LED chips are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.

Abstract: Solid state lighting apparatuses are adapted to operate with alternating current (AC) received directly from an AC power source. An exemplary apparatus includes a substrate and multiple sets of one or more solid state light emitters disposed over the substrate. Multiple sets of solid state light emitters are configured to be activated and/or deactivated at different times relevant to one another during portions of an AC cycle, and optionally have different duty cycles. Emitter configurations, color combinations, and/or circuit components reduce perceivable flicker, color shifts, and/or spatial variations in luminous flux. Color temperature and/or beam pattern are adjustable. Multiple emitters are arranged along non-coplanar substrate portions.

Abstract: A luminaire comprises at least one waveguide having a first region that emits a first luminous intensity pattern and a second region that emits a second luminous intensity pattern different from the first luminous intensity pattern. The luminaire further includes a plurality of LED elements and circuitry to control the plurality of LED elements to cause the luminaire to produce a selected one of a plurality of luminous intensity patterns.

Abstract: A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer.

Abstract: A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Abstract: A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

Abstract: Solid state lighting apparatuses are adapted to operate with alternating current (AC) received directly from an AC power source. An exemplary apparatus includes a substrate and multiple sets of one or more solid state light emitters disposed over the substrate. Multiple sets of solid state light emitters can be configured to be activated and/or deactivated at different times relevant to one another during portions of an AC cycle, and may optionally have different duty cycles. Emitter configurations, color combinations, and/or circuit components may reduce perceivable flicker, color shifts, and/or spatial variations in luminous flux. Color temperature and/or beam pattern may be adjusted. Multiple emitters may be arranged along non-coplanar substrate portions.

Abstract: According to one aspect, a waveguide includes a waveguide body having a coupling cavity extending therethrough and a plug member having a first portion disposed in the coupling cavity. The plug member includes an outer surface substantially conforming to the coupling cavity and a second portion extending from the first portion into the coupling cavity and a reflective surface adapted to direct light in the coupling cavity into the waveguide body.

Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof. The body of material has a first side, a second side opposite the first side, and a plurality of interior bores extending between the first and second sides each adapted to receive a light emitting diode. Extraction features are disposed on the second side and the extraction features direct light out of at least the first side and at least one extraction feature forms a taper disposed at an outer portion of the body.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: According to one aspect, a luminaire includes a waveguide body having an interior coupling cavity extending into a portion of the waveguide body remote from an edge thereof. The luminaire further includes an LED element extending into the interior coupling cavity having first and second sets of LEDs wherein each LED of the first set comprises a blue-shifted yellow LED and each LED of the second set comprises a red LED wherein the red LEDs are disposed between the blue-shifted yellow LEDs and wherein the blue-shifted yellow LEDs have a first height and the red LEDs have a second height less than the first height. The LED element further includes a lens disposed over the first and second sets of LEDs.

Abstract: A green-shifted red solid state lighting device includes at least one green solid state light emitter arranged to stimulate emissions from at least one red lumiphor, arranged in combination with at least one blue solid state light emitter. Such device may be devoid of any yellow lumiphor arranged to be stimulated by a blue solid state light emitter. A green shifted red plus blue (GSR+B) lighting device exhibits reduced Stokes Shift losses as compared to a blue shifted yellow plus red (BSY+R) lighting device, with comparable color rendering performance and similar efficiency, enhanced color stability over a range of operating temperatures, and enhanced color rendering performance at higher correlated color temperatures. Additional solid state emitters and/or lumiphors may be provided.

Abstract: An integrated circuit component can include an integrated circuit package and a plurality of terminals provided on the exterior of the integrated circuit package. The terminals are configured to provide electrical connectivity to an interior of the integrated circuit package and a plurality of light emitting diode (LED) segments that includes an LED string in the interior of the package, coupled to the plurality of terminals.

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one aspect, a light emitter package can include a submount, an array of light emitter chips disposed on a portion of the submount, and a lens provided over the submount and covering at least portions of the array. In some aspects, at least some of the light emitter chips can be adapted to emit light of a first dominant wavelength. In further aspects, at least some other light emitter chips are adapted to emit light of a second dominant wavelength that is different than the first dominant wavelength. In some aspects, the lens can be asymmetric. In some aspects, a collective center of the chips, or a center of an array of chips can be offset from a center of the asymmetric lens.

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.

Abstract: A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Abstract: Solid state lighting devices include least one solid state emitter and multiple lumiphors, arranged to output aggregated emissions comprising at least one short wavelength blue peak, at least one long wavelength blue (LWB) peak, at least one yellow and/or green peak, and at least one red and/or orange peak. Presence of long wavelength blue enhances color rendering. At least one solid state emitter may include a short wavelength blue LED, LWB LED, and/or UV LED. Multiple emitters may be provided. Resulting devices may provide CRI greater than 85, efficiency of greater than 50 lm/watt, and color stability in a range of ?u?v??0.008 over a temperature change of 75° C.