Abstract: A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side.

Abstract: Seat pan for fastening to a seat frame of a vehicle seat. The seat pan has a profile structure made up of multiple profiles, and on its bottom side has crossbeam receptacles, preferably tube receptacles which are open at the bottom, for placement on a crossbeam, in particular a transverse tube of the seat frame, which extends in the transverse direction. The seat pan is preferably injection-molded from a plastic material, wherein through holes which extend through the profile structure in the vertical direction are formed between the profiles, preferably between all profiles.

Abstract: A method of producing a semiconductor device is provided. The method includes: providing a semiconductor wafer, the wafer including an upper layer of a semiconductor material, an inner etch stop layer and a lower layer; forming a plurality of functional areas in the upper layer; performing a selective first etch process on the upper layer so as to separate the plurality of functional areas from each other by trenches etched through the upper layer, the first etch process being substantially stopped by the inner etch stop layer; and removing the lower layer by a second etch process, the second etch process being substantially stopped by the inner etch stop layer.

Abstract: A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side.

Abstract: A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or more contact pads is electrically contacted to the carrier; a first encapsulation material at least partially surrounding the chip; and a second encapsulation material at least partially surrounding the first encapsulation material.

Abstract: Vehicle seat has at least a front foot, a rear foot, a four-link configuration having four link parts coupled to one another via hinge points, and a compensation spring. Front foot and rear foot are accommodated in a longitudinal rail in a longitudinally adjustable manner, and the rear foot is releasable from the longitudinal rail after unlocking. Vehicle seat is movable forward from a seating position having a locked rear foot, after rear foot is unlocked, into a functional position with adjustment of four-link configuration, and with at least temporary assistance from the compensation spring. Vehicle seat has a support rod which is adjustably accommodated on the four-link configuration, and in the forward functional position the support rod comes into contact in front of the front foot, and in particular on the longitudinal rail.

Abstract: Vehicle seat has at least a front foot, a rear foot, a four-link configuration having four link parts coupled to one another via hinge points, and a compensation spring. Front foot and rear foot are accommodated in a longitudinal rail in a longitudinally adjustable manner, and the rear foot is releasable from the longitudinal rail after unlocking. Vehicle seat is movable forward from a seating position having a locked rear foot, after rear foot is unlocked, into a functional position with adjustment of four-link configuration, and with at least temporary assistance from the compensation spring. Vehicle seat has a locking apparatus which automatically locks or clamps together at least two link parts of the four-link configuration in order to compensate for production-related tolerances. Four link parts may include a seat part, a backrest part, a receiving part, and a coupling rocker.

Abstract: A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.

Abstract: A chip arrangement is provided, the chip arrangement including: a carrier; a chip disposed over the carrier, the chip including one or more contact pads, wherein a first contact pad of the one or more contact pads is electrically contacted to the carrier; a first encapsulation material at least partially surrounding the chip; and a second encapsulation material at least partially surrounding the first encapsulation material.

Abstract: A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.

Abstract: Vehicle seat has at least a front foot, a rear foot, a four-link configuration having four link parts coupled to one another via hinge points, and a compensation spring. Front foot and rear foot are accommodated in a longitudinal rail in a longitudinally adjustable manner, and the rear foot is releasable from the longitudinal rail after unlocking. Vehicle seat is movable forward from a seating position having a locked rear foot, after rear foot is unlocked, into a functional position with adjustment of four-link configuration, and with at least temporary assistance from the compensation spring. Vehicle seat has a locking apparatus which automatically locks or clamps together at least two link parts of the four-link configuration in order to compensate for production-related tolerances. Four link parts may include a seat part, a backrest part, a receiving part, and a coupling rocker.

Abstract: Vehicle seat has at least a front foot, a rear foot, a four-link configuration having four link parts coupled to one another via hinge points, and a compensation spring. Front foot and rear foot are accommodated in a longitudinal rail in a longitudinally adjustable manner, and the rear foot is releasable from the longitudinal rail after unlocking. Vehicle seat is movable forward from a seating position having a locked rear foot, after rear foot is unlocked, into a functional position with adjustment of four-link configuration, and with at least temporary assistance from the compensation spring. Vehicle seat has a support rod which is adjustably accommodated on the four-link configuration, and in the forward functional position the support rod comes into contact in front of the front foot, and in particular on the longitudinal rail.

Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

Abstract: An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

Abstract: An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

Abstract: An integrated circuit having a housing accommodating the integrated circuit. It being possible for the integrated circuit to be put optionally into one of a plurality of different operating modes by virtue of the selective provision of electrical connections between specific contact points constructed on the integrated circuit. The device described is distinguished by the fact that all the contact points of the integrated circuit which are provided for the operation and configuration of the integrated circuit are connected to terminal elements of the housing with which external contact can be made.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.