Patents by Inventor Bernd Rohrmoser

Bernd Rohrmoser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Quad flat non-leaded package comprising a semiconductor device
    Patent number: 7119421
    Abstract: A semiconductor package is proposed. The semiconductor package includes a discrete semiconductor chip on a die pad, a plurality of bond pads situated next to the chip and formed with a plurality of connecting mechanisms and an encapsulant for encapsulating the chip and the pads. In a preferred embodiment the die pad and/or the bond pads comprise means for vertically and laterally interlocking the pads to the encapsulant. The interlocking means of the bond pads and the die pad significantly enhance the bonding strength between the pads and the encapsulant for preventing delamination or cracking, so that quality and reliability of the quad flat non-leaded semiconductor package comprising a discrete can be assured.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: October 10, 2006
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Bernd Rohrmoser, Thomas Weiss
  • Quad flat non-leaded package comprising a semiconductor device
    Publication number: 20050173793
    Abstract: A semiconductor package is proposed. The semiconductor package includes a discrete semiconductor chip on a die pad, a plurality of bond pads situated next to the chip and formed with a plurality of connecting mechanisms and an encapsulant for encapsulating the chip and the pads. In a preferred embodiment the die pad and/or the bond pads comprise means for vertically and laterally interlocking the pads to the encapsulant. The interlocking means of the bond pads and the die pad significantly enhance the bonding strength between the pads and the encapsulant for preventing delamination or cracking, so that quality and reliability of the quad flat non-leaded semiconductor package comprising a discrete can be assured.
    Type: Application
    Filed: June 4, 2003
    Publication date: August 11, 2005
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Bernd Rohrmoser, Thomas Weiss