Abstract: An assembly between a filling machine and a conveyor for the production of pasty shaped parts, having various shape-generating elements which are adapted to the respective shape of differently shaped parts and can be driven, has an outlet and at least one universal drive and bearing interface for the shape-generating elements which can be driven via the interface.

Abstract: An assembly between a filling machine and a conveyor for the production of pasty shaped parts, having various shape-generating elements which are adapted to the respective shape of differently shaped parts and can be driven, has an outlet and at least one universal drive and bearing interface for the shape-generating elements which can be driven via the interface.

Abstract: A method and a device for separating food products, including to permit a straight cut at high cycle rates, the food product is conveyed by a conveying device in the direction of transport. The food product is cut through, where a cutting element is moved in the direction of transport and transverse to the direction of transport, wherein the motion of the cutting element transverse to the direction of transport is controlled independently of its motion in the direction of transport and the food product does not rest on the cutting area on the conveying means.

Abstract: An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.