Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Abstract: A thermal monitoring system (101) for sensing a temperature of a monitored device (104) includes a carrier (102) having a first surface (112) and a biasing element (122) coupled to the carrier (102) and configured to extend between the carrier (102) and the monitored device (104) to provide a first thermal conduction path therebetween. The biasing element (122) includes a first end (128) contacting the first surface (112) and a second end (130) opposite the first end (128) and configured to contact the monitored device (104). The biasing element (122) further includes a main body (132) formed of a thermally conductive material extending continuously between the first end (128) and the second end (130). The main body (132) is compressible between the monitored device (104) and the carrier (102). The thermal monitoring system (101) further includes a temperature sensor (124) coupled to the carrier (102) and configured to detect a temperature of the monitored device (104).

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

Abstract: A thermal monitoring system (101) for sensing a temperature of a monitored device (104) includes a carrier (102) having a first surface (112) and a biasing element (122) coupled to the carrier (102) and configured to extend between the carrier (102) and the monitored device (104) to provide a first thermal conduction path therebetween. The biasing element (122) includes a first end (128) contacting the first surface (112) and a second end (130) opposite the first end (128) and configured to contact the monitored device (104). The biasing element (122) further includes a main body (132) formed of a thermally conductive material extending continuously between the first end (128) and the second end (130). The main body (132) is compressible between the monitored device (104) and the carrier (102). The thermal monitoring system (101) further includes a temperature sensor (124) coupled to the carrier (102) and configured to detect a temperature of the monitored device (104).

Abstract: A double-threaded connector or spacer according may be self-threading such that insertion into a mounting hole in a PCB will cause the interior of the mounting hole to become threaded to match the double-threaded connector or spacer. The double- threaded connector or spacer installed in a mounting hole of a carrier. A “half circle” portion of daughter card is held in place between the double-threaded connector or spacer and screw. The half circle portion of the daughter card is plated to make electrical contact with the double-threaded connector or spacer, for example, to allow for grounding of the daughter card via the carrier, e.g., PCB.

Abstract: A housing design and method of providing electromagnetic compatibility (EMC) by mitigating a slot antenna in a corner region of a housing, the corner profile including an electrically conductive insert that has a spring bias, such as a spring or coated plastic member, in a corner of the housing.

Abstract: A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat conductor is to be positioned between an electronic device and a heat sink to facilitate cooling of the electronic device. During cold start-up of the electronic device, the variable heat conductor acts as a thermal isolator, causing the electronic device to warm more quickly following the cold start-up. The variable heat conductor may fully conduct heat at higher temperatures that are at or above a desired temperature set-point.

Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

Abstract: Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

Abstract: A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat conductor is to be positioned between an electronic device and a heat sink to facilitate cooling of the electronic device. During cold start-up of the electronic device, the variable heat conductor acts as a thermal isolator, causing the electronic device to warm more quickly following the cold start-up. The variable heat conductor may fully conduct heat at higher temperatures that are at or above a desired temperature set-point.

Abstract: Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract: A wedge lock for use with a single board computer includes a first portion configured to move in a first direction and a second portion configured to move in a plurality of directions in response to the movement of the first portion and to facilitate securing the single board computer in an operating environment and to facilitate conduction cooling of the single board computer.

Abstract: A wedge lock for use with a single board computer includes a first portion configured to move in a first direction and a second portion configured to move in a plurality of directions in response to the movement of the first portion and to facilitate securing the single board computer in an operating environment and to facilitate conduction cooling of the single board computer.

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.