Abstract: A field device in which device-related data are intelligently stored such that the lifetime of the memory unit and thus the possible service life of the field device is increased initially buffer-stores the generated data in a FRAM-based buffer memory unit and then stores them as a common data packet in an EEPROM-based long-term memory unit as soon as the device-related data have reached a defined data volume in the buffer memory unit. Collecting the data beforehand and then copying the resulting data packet to the long-term memory unit in the form of a common dataset reduces the write cycles to the EEPROM memory, as a result of which the lifetime of the EEPROM memory is lengthened. It is not necessary to retain any large FRAM-based data memory, making it possible to keep memory space costs for the field device low.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

Abstract: An automation field device for use in a potentially explosive area comprises: two connecting terminals for connecting a two-wire line via which a current can be supplied; a sensor and/or actuator element for capturing and/or setting a process variable; a field device electronic system connected to the connecting terminals and designed to provide a power supply for the field device on the basis of the supplied current and also to transmit or receive, by means of the two-wire line, the process variable captured by means of the sensor element and/or a process variable to be set by the actuator element; and an explosion protection unit incorporated in a current path between the two connecting terminals to limit a possible short-circuit current and which comprises the at least two diodes in series and at least one resistor connected in parallel to the at least two diodes.

Abstract: An intrinsically safe field device of automation technology comprises connection terminals via which a current can be supplied; a sensor element and/or actuator element; field device electronics with a current path between the connection terminals and a voltage regulator incorporated into the current path; and an explosion protection unit comprising at least two controllable switching elements, incorporated into the current path in series, and two threshold value circuits designed such that a first threshold value circuit controls a first switching element as a function of a first threshold value, and a second threshold value circuit controls a second switching element as a function of a second threshold value, such that, upon the first and/or second threshold value being reached, the current is limited to the first and/or second threshold value, and the threshold value circuits are connected in parallel to the voltage regulator.

Abstract: An automation field device comprises a first, a second, and a third connection pin; and a field device electronics designed to be operated either in a two-conductor mode or in a three-conductor mode. The field device electronics have an energy supply unit designed to provide internal energy supply exclusively by means of the fed current in the two-conductor mode. In the three-conductor mode, an additional auxiliary current is to be fed to the field device electronics via an additional single-wire line connected to the third connection pin, and the energy supply unit is also designed to provide the internal energy supply via the fed current and the fed additional auxiliary current. Furthermore, the field device electronics are designed to use the additionally fed auxiliary current for internal energy supply only if the current fed by means of the two-wire line is not sufficient for the internal energy supply.

Abstract: Disclosed is a field device electronics for a field device of automation engineering, comprising: first and second terminals for connecting the field device electronics to a cable for an electrical input current to the field device electronics; a series regulator to set the input current; a shunt regulator following the series regulator; a first capacitance connected in parallel with the shunt regulator for energy storage; a supply circuit connected in parallel with the shunt regulator and the first capacitance for providing an operating voltage; and connected after the supply circuit and supplied by the operating voltage, a control unit adapted to register a buffer voltage lying across the first capacitance, based on the registered buffer voltage, to make a decision concerning at least one part of the field device electronics.

Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Abstract: The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

Abstract: Disclosed is a field device electronics for a field device of automation engineering, comprising: first and second terminals for connecting the field device electronics to a cable for an electrical input current to the field device electronics; a series regulator to set the input current; a shunt regulator following the series regulator; a first capacitance connected in parallel with the shunt regulator for energy storage; a supply circuit connected in parallel with the shunt regulator and the first capacitance for providing an operating voltage; and connected after the supply circuit and supplied by the operating voltage, a control unit adapted to register a buffer voltage lying across the first capacitance, based on the registered buffer voltage, to make a decision concerning at least one part of the field device electronics.

Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

Abstract: The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

Abstract: The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

Abstract: A field device has a housing providing EMC-protection. The housing includes a conductive housing core, which is surrounded on all sides by a non-conductive housing jacket secured thereon by force-interlocking, e.g. frictional interlocking, or by material bonding. At least one electrically conductive barrier is placed on and connected with an electrically conducting region of the housing core and divides the interior of the housing into at least two chambers with different degrees of EMC-protection. The barrier contains a passageway, with which at least a first electronic circuit and a second electronic circuit, which are located in different chambers, are contacted with one another.

Abstract: A circuit configuration for monitoring and/or for regulating supply voltages. The circuit enables at least two supply voltages (U12) or (U22) that are produced by means of two feed-ins (Q1, Q2) and that are provided for consumer circuits (V1, V2) to be monitored and limited simultaneously. To this end, the circuit configuration comprises a corresponding voltage monitoring electronics unit which detects the supply voltages (U12, U22) and compares them with associated tolerance values (?U12, ?U22). The voltage monitoring electronics unit also provides a control signal (y) which signals whether the first supply voltage (U12) is lower than the associated tolerance value (?U12). The control signal (y) is used to control a shunt electronics unit through which a shunt current (IS) passes temporarily.

Abstract: The invention concerns a device for measuring and/or monitoring a process parameter, with a sensor, an intermittently working measurement circuit, which has at least one energy storer unit, wherein the measurement circuit or individual components of the measurement circuit are activated for a predetermined time span, the so-called active phase, and with a control center, wherein the measurement circuit and the control center are connected with one another over a two-wire line and wherein a control-/evaluation-unit is provided, which activates the measurement circuit at the earliest, when the energy in the energy storer unit has reached a predetermined level.