Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: An electronics unit includes a support in the form of a plate of an aluminum alloy. A ceramic substrate is adhesively attached to the substrate. A system of conductor tracks on which electronic power components are arranged is applied to the ceramic substrate. A film of an aluminum-silicon alloy is arranged between the support and the ceramic substrate and is chemically bonded to the support and the ceramic substrate in a thermal process.

Abstract: The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) arm connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.

Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part (9) of a housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

Abstract: The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) are connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.

Abstract: A power electronics unit with a sheet-like carrier element, on which interconnects 5 are arranged for the electrical Connection of electrical power components 6 and control components 7 of a circuit, likewise located on the carrier element. The carrier element is a heat sink 1, on which the interconnects 5 have been applied by a heat-conducting adhesive 3, and a minimum thickness of the heat-conducting adhesive 3 to allow the heat-conducting adhesive 3 to be an electrical insulating layer is ensured by spacers 4 in the heat-conducting adhesive 3.

Abstract: A mechanical/electrical transducer which has a bridge circuit formed by electrically connecting strain-sensitive thick-film resistors by conductor tracks, the thick-film resistors being arranged directly on a metallic component to be subjected mechanically to torsional loading and lying outside an axis of the component to be loaded which is neutral with respect to bending moments, it being possible to tap an electrical signal corresponding to the strain of the thick-film resistors when the component is subjected to torsion.

Abstract: The invention relates to a power electronics unit with a sheet-like carrier element, on which interconnects 5 are arranged for the electrical connection of electrical power components 6 and control components 7 of a circuit, likewise located on the carrier element. The carrier element is a heat sink 1, on which the interconnects 5 have been applied by means of a heat-conducting adhesive 3, and a minimum thickness of the heat-conducting adhesive 3 to allow the heat-conducting adhesive 3 to be an electrical insulating layer is ensured by spacers 4 in the heat-conducting adhesive 3.