Abstract: Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.

Abstract: A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.

Abstract: An insertion tube (1) for firing sub-caliber ammunition bodies (20) using a high caliber weapon (10) is inserted into the loading chamber (11) of the weapon (10). The tube wall (2) of the insertion tube (1) has penetrating recesses (3) for compensating pressure differences between the inside of the insertion tube (1) and the loading chamber (11). A weapon includes an insertion tube (1) which can be inserted into the loading chamber (11) of the weapon (10) for firing a sub-caliber ammunition body (20), the insertion tube (1) being designed in the above-described manner.

Abstract: An insertion tube (1) for firing sub-caliber ammunition bodies (20) using a high caliber weapon (10) is inserted into the loading chamber (11) of the weapon (10). The tube wall (2) of the insertion tube (1) has penetrating recesses (3) for compensating pressure differences between the inside of the insertion tube (1) and the loading chamber (11). A weapon includes an insertion tube (1) which can be inserted into the loading chamber (11) of the weapon (10) for firing a sub-caliber ammunition body (20), the insertion tube (1) being designed in the above-described manner.

Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.

Abstract: The invention relates to a micromechanical actuator, especially a micro-mirror scanner, comprising an actuator unit in an outer frame which unit is suspended in the outer frame via two torsion elements, and electrostatic tilt drives from intermeshing first and second comb-type electrodes which are off-set from each other vertically. The first electrodes are rigidly connected to the outer frame and the second electrodes to the outer frame via an outer connecting element and to the actuator unit via an inner connecting element. The inner connecting element has a spring which extends in parallel to the outer tilting axis, which is connected to the same in a section of the actuator unit close the outer tilting axis, and which is designed and arranged to be rigid in the vertical direction and flexible at a right angle to the vertical direction.

Abstract: The invention relates to a low-fibrillation molded body containing a tape (1) essentially consisting of polytetrafluoroethylene, characterized in that the tape is composed of at least four plies (7,8,9,10) of essentially equal width arranged essentially parallel to each other, said plies being obtainable by folding.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: The invention relates to a semiconductor component which is capable of blocking such as an (IGBT), a thyristor, a GTO or diodes, especially schottky diodes. An insulator profile section (10a, 10b, 10c, 10d, 11) provided in the border area of an anode metallic coating (1, 31) is fixed (directly in the edge area) on the substrate (9) of the component. The insulator profile has a curved area (KB) and a base area (SB), said curved area having a surface (OF) which begins flat and curves outward and upward in a steadily increasing manner. A metallic coating (MET1; 30a, 30b, 30c, 30d, 31b) is deposited on the surface (OF). Said coating directly follows the surface curvature and laterally extends the inner anode metallic coating. The upper end of the curved metallic coating (MET1; 30a, 30b . . . ) is distanced and insulated from one of these surrounding outer metallic coatings (MET2; 3) by the surrounding base area (SB) of the insulator profile (10a, . . .

Abstract: A tunable high-frequency capacitor includes first and second fixed electrodes, the first fixed electrode having a high-frequency input connection, and the second fixed electrode having a high-frequency output connection. A movable electrode is arranged facing and spaced apart from the fixed electrodes and is supported by means of a suspension which causes a displacement of the movable electrode in relation to the fixed electrode depending on a control signal that is applied.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: A Semiconductor component, such as an IGBT, a thyristor, a GTO or a diode, and especially a Schottky diode is provided that is capable of blocking for producing a termination portion of a semiconductor component. An insulator profile of an insulator portion includes a curved surface, which is free of steps and is produced by gray-tone lithography in the termination portion of an anode. The device also includes a substrate that is covered with an insulating layer having a thickness of between 0.5 &mgr;m and 15 &mgr;m, an insulator layer having a thickness is covered with a photosensitive layer (photoresist layer) where the photoresist layer is exposed through a mask, which changes in its gray-tone value in accordance with the course of curvature of the surface of at least one insulator profile, and is subsequently structured to form at least one resist remainder.

Abstract: A sensor element for electrically measuring the position of liquid levels, comprising a substrate (2) and a plurality of electrodes (3) that can be contacted individually and that are mounted on the substrate, characterized in that the electrodes comprise sensor-active partial electrodes (5) that are networked with electrical connections (7), with the partial electrodes of two respective electrodes always being positioned opposite one another, separated by a distance, as partial electrode pairs (11) and with the electrode pairs (8) thus formed recurring periodically over the length of the sensor. Quasi-digital measuring methods are derived from the behavior of the impedance of the electrode pairs, whereby the liquid level is measured by detecting a conductivity boundary in a capillary filling.

Abstract: The present invention relates to an assembly of variable capacitance as well as to a method of operating the assembly. In the assembly, a variable capacitor is formed by a variable coverage or a variable distance of at least one first (4) and one second electrically conductive region (5). The first electrically conductive region (4) is configured on or in a substrate (1) and said second electrically conductive region (5) is configured on or in an actuator element (3) of a first micro-mechanical actuator (2). The actuator (2) is disposed on the substrate (1) in such a way that it can perform a movement of the actuator element (3) with the second region (5) along a surface of the substrate (1) at different positions relative to the first region (4), at which positions the second region (5) overlaps the first region (4) at least partly.

Abstract: The invention relates to a micro reactor arrangement, particularly for a micro relay. It comprises a substrate (1) with two thermomechanical micro actuators (3, 4). In response to thermal stimulation, the first micro actuator (3) performs a movement in parallel with the substrate surface (2), while the second micro actuator moves in a direction orthogonal on the substrate surface (2). Both thermomechanical micro actuators are so disposed relative to each other that the first micro actuator (3), in the extended state, reaches under the second micro actuator (4). With these provisions, the first micro actuator (3) can be maintained in this position without supply of power when the second micro actuator (4) is de-energized. With the present micro actuator arrangement, one can achieve the advantages of a high activation force and long positioning travels of thermomechanical micro actuators for micro relays, without the necessity to supply energy for maintaining the individual switching states.

Abstract: The present invention relates to an assembly of variable capacitance as well as to a method of operating the assembly. In the assembly, a variable capacitor is formed by a variable coverage or a variable distance of at least one first (4) and one second electrically conductive region (5). The first electrically conductive region (4) is configured on or in a substrate (1) and said second electrically conductive region (5) is configured on or in an actuator element (3) of a first micro-mechanical actuator (2). The actuator (2) is disposed on the substrate (1) in such a way that it can perform a movement of the actuator element (3) with the second region (5) along a surface of the substrate (1) at different positions relative to the first region (4), at which positions the second region (5) overlaps the first region (4) at least partly.

Abstract: A micromechanical pump has a membrane (2) positioned above a substrate (1). The substrate is provided with a cavity (8) which is formed in an endlessly continuous shape (e.g., circular) to provide a channel for a drive fluid. A cover (9) is positioned above the substrate with the membrane being between the substrate and cover. The cover is provided with an inlet (11) and outlet (10). Electrodes (3, 4) are provided around the floor of the cavity. The electrodes are selectively actuated so as to attract selected areas of the membrane resulting in a gap forming between the cover and the selected areas of the membrane. The areas of the membrane above the non-selected electrodes form a seal with the cover. By selectively actuating the electrodes a peristaltic pumping action results in a pumped fluid traveling from the inlet, through the gaps and out the outlet.

Abstract: A tuneable high-frequency capacitor includes first and second fixed electrodes (102a, 102b), the first fixed electrode (102a) comprising a high-frequency input connection (114), and the second fixed electrode (102b) comprising a high-frequency output connection (118). A movable electrode (104) is arranged facing and spaced apart from the fixed electrodes (102a, 102b) and is supported by means of a suspension (106, 108) which causes a displacement of the movable electrode (104) in relation to the fixed electrodes (102a, 102b) depending on a control signal that is applied.

Abstract: The invention relates to a micro reactor arrangement, particularly for a micro relay. It comprises a substrate (1) with two thermomechanical micro actuators (3, 4). In response to thermal stimulation, the first micro actuator (3) performs a movement in parallel with the substrate surface (2), while the second micro actuator moves in a direction orthogonal on the substrate surface (2). Both thermomechanical micro actuators are so disposed relative to each other that the first micro actuator (3), in the extended state, reaches under the second micro actuator (4).

Abstract: The invention relates to a high-pressure piston cylinder unit, especially an injection pump or an injection valve for an internal combustion engine, and to a method for producing one such high-pressure piston cylinder unit. The high-pressure piston cylinder unit has a piston which is guided inside a cylinder bore and which is coupled to an actuating element. The piston is subjected to a high pressure differential. According to the invention, fine grooves which run very close to one another are configured in at least one part of the guiding surface of the piston. The grooves ensure hydraulic pressure compensation on the periphery of the guiding surface, thus reducing wear, and prevent leakage in a longitudinal guiding direction.