Patents by Inventor Bernd Waidhaus

Bernd Waidhaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method for producing the electronic component
    Publication number: 20020195701
    Abstract: An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.
    Type: Application
    Filed: June 20, 2002
    Publication date: December 26, 2002
    Inventors: Thomas Bemmerl, Holger Worner, Bernd Waidhaus