Patents by Inventor Bernd Winkens

Bernd Winkens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sandwich-structured intelligent power module
    Patent number: 6646884
    Abstract: The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: November 11, 2003
    Assignee: Tyco Electronics Logistics AG
    Inventors: Michael Frisch, Bernd Winkens