Abstract: For a device for the detection of substrates stacked at an opening of a wall element, there existed the problem of constructing the detection device in such a way that the detection of the position of the substrates can be performed more flexibly with respect to the course of measurement and the measuring method employed and a defined approach of a sensor system to the semiconductor substrate to be detected is ensured in a definite position of measurement with a lowered risk of particle generation. A transmitting and receiving device (11) consists of a vertical drive mechanism (10) mounted on the wall element (1) and a sensor head (13) that can be adjusted between a lower and an upper position by means of the vertical drive mechanism (10), said sensor head being arranged so as to pivot on the vertical drive mechanism (10) in order to pivot into the opening (4).

Abstract: For a device for the detection of substrates stacked at an opening of a wall element, there existed the problem of constructing the detection device in such a way that the detection of the position of the substrates can be performed more flexibly with respect to the course of measurement and the measuring method employed and a defined approach of a sensor system to the semiconductor substrate to be detected is ensured in a definite position of measurement with a lowered risk of particle generation.

Abstract: An arrangement for handling wafer-shaped objects is to ensure a high degree of positioning accuracy with increased productivity, freely selectable transport paths, and low mechanical expenditure under SMIF conditions. The arrangement has at least one indexing device for supplying and accepting the objects at a supplying and accepting location situated in a handling plane and at least one transporting device for transporting the wafer-shaped objects between the supplying and accepting location and a work station. The work station, together with at least one other work station, is arranged substantially coaxially to a central point through which passes a rotational axis of a changer. The arrangement is applicable in the manufacture of integrated circuits.

Abstract: The object of a device for coupling loading and unloading devices with semiconductor machines is to couple devices required for the use of SMIF technology with semiconductor processing machines in which subsequent integration of SMIF technology is not possible, wherein the charging to be carried out after coupling is highly flexible and capable of managing increasing dimensions of semiconductor wafers. An adjustable receiving element for the loading and unloading device is provided inside a movable enclosure, this receiving element being displaceable between at least two planes situated one above the other, one plane serving for charging the loading and unloading device and every other plane being used for the charging of the semiconductor machine carried out by the loading and unloading device. The enclosure has aligning and holding elements for fastening to a coupling element which is aligned with the semiconductor processing machine.

Abstract: A device for handling disk-shaped objects in a handling plane of a local clean room has the object of ensuring process steps preceding or following the processing and inspection of the disk-shaped objects under the conditions of a local clean room with the use of SMIF boxes. The handling plane (H--H) is in a fixed constructional relationship with a reference plane (E--E) of at least one device comprising the magazine seat as a component part, which device serves to index the shelves of magazines and disk-shaped objects contained therein and is arranged above an intermediate base dividing the clean room into two partial spaces located one above the other, in which an air flow component of an air flow is directed from the partial space above the intermediate base into the partial space below the intermediate base. The device can be used in the manufacture of integrated circuits, particularly for handling tasks.

Abstract: A device for indexing magazine compartments of a magazine and wafer-shaped objects contained therein to ensure precise access of the removing and charging device in any given predetermined plane of the magazine regardless of dimensional tolerances. An optoelectronic sensor having a transmitter and receiver emits a bundle of measurement rays to detect the position of the wafer-shaped objects as well as the position of the magazine compartments relative to a reference plane whose location is rigidly defined by design with respect to a first handling plane for removing and charging. The magazine is adjustable vertically in a measurable manner for removal and charging by a magazine seat via a magazine lift. The device is applicable in the manufacture of integrated circuits, in particular for handling wafer-shaped objects.