Patents by Inventor Bernhard Büttner

Bernhard Büttner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194743
    Abstract: A semiconductor wafer having a front side and a rear side, the front side is opposite the rear side. The front side has different mechanical stress regions. A structured carrier substrate that has different materials with different material properties is arranged on the front side, wherein the different materials are arranged on the different mechanical stress regions.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 13, 2024
    Inventors: Bernhard Polzinger, Christian Foerster, Jens Buettner, Kristina Vogt
  • Patent number: 9588930
    Abstract: A method includes exchanging data between a chip card and a terminal in a contact-based manner via a contact field. The method comprises the steps of: activating a first contact assignment in response to a first communication protocol present on the contact field and occupying a first part of contact surfaces of the contact field; recognizing a change of the communication protocol from a first communication protocol to a second communication protocol with a protocol recognition unit in the chip card; and activating a second contact assignment in response to the recognized second communication protocol occupying a second part of contact surfaces of the contact field. The first and the second part of contact surfaces of the contact field are selected from an ISO-7816-2 contact field having a maximum of six contact surfaces and the second communication protocol requires at least two data lines.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: March 7, 2017
    Assignee: GIESECKE & DEVRIENT GMBH
    Inventors: Bernhard Büttner, Robert Griesmeier, Karl Eglof Hartel
  • Publication number: 20140117098
    Abstract: A method for manufacturing a portable data carrier includes the steps of: providing a carrier band having an upper side and a lower side disposed opposite the upper side including a contact field formed with at least one contact area; arranging a semiconductor circuit on the lower side of the carrier band and electroconductively connected with the corresponding contact area; and carrying out an injection molding process on the lower side a potting compound formed around the semiconductor circuit and having outer dimensions according to a portable data carrier standard specification. An injection channel for injecting the potting compound is arranged on a side of the potting compound mold parallel to the lower side, and after the injection of the potting compound a depression remains in the finished data carrier due to the injection channel. A portable data carrier includes the features and is used as a subscriber identity module.
    Type: Application
    Filed: June 14, 2012
    Publication date: May 1, 2014
    Inventors: Bernhard Büttner, Thomas Tarantino, Robert Griesmeier
  • Publication number: 20140082247
    Abstract: A method includes exchanging data between a chip card and a terminal in a contact-based manner via a contact field. The method comprises the steps of: activating a first contact assignment in response to a first communication protocol present on the contact field and occupying a first part of contact surfaces of the contact field; recognizing a change of the communication protocol from a first communication protocol to a second communication protocol with a protocol recognition unit in the chip card; and activating a second contact assignment in response to the recognized second communication protocol occupying a second part of contact surfaces of the contact field. The first and the second part of contact surfaces of the contact field are selected from an ISO-7816-2 contact field having a maximum of six contact surfaces and the second communication protocol requires at least two data lines.
    Type: Application
    Filed: May 8, 2012
    Publication date: March 20, 2014
    Applicant: GIESECKE & DEVRIENT GMBH
    Inventors: Bernhard Büttner, Robert Griesmeier, Karl Eglof Hartel