Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: An LED module or assembly is disclosed, the assembly having at least one LED component mounted on a support or circuit board and an optical element which encloses the at least one LED component and defines an interior space in which the at least one LED component is housed. A vent device is defined within the optical element for permitting gases generated from operation of the at least one LED component to be vented to atmosphere. The vent device prevents outside moisture from entering the interior space, but permits the gases to pass out to atmosphere for minimizing the likelihood of fogging of the optical elements in the interior space of the assembly.

Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.

Abstract: An LED module or assembly is disclosed, the assembly having at least one LED component mounted on a support or circuit board and an optical element which encloses the at least one LED component and defines an interior space in which the at least one LED component is housed. A vent device is defined within the optical element for permitting gases generated from operation of the at least one LED component to be vented to atmosphere. The vent device prevents outside moisture from entering the interior space, but permits the gases to pass out to atmosphere for minimizing the likelihood of fogging of the optical elements in the interior space of the assembly.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.

Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.

Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.

Abstract: The invention relates to an electro-optical arrangement for coupling light signals into an optical waveguide, which has a laser diode for emitting light signals and a microlens, which focuses light signals emitted by the laser for coupling into the optical waveguide. According to the invention, the microlens is arranged on a carrier carrying the laser diode.

Abstract: The invention relates to a lighting device, comprising a light guide (11; 31; 43), a light source (12; 32, 33; 41), which couples the light that is emitted into the light guide, and a support (10; 20, 21; 22, 23; 30, 35, 38; 40, 42) in the form of a shell, consisting of several interconnected sub-shells which enclose the light guide, at least in the area in which the light should be deviated. The invention also relates to a method for producing a lighting device.

Abstract: The invention relates to an optoelectronic module for coupling light signals into and out of an optical waveguide. The module has a carrier having at least a first side, a light transmitter for emitting light signals, which is arranged on the carrier, a receiver for detecting light signals, which is arranged on the carrier, and a beam-shaping element for coupling light signals of the laser diode out of the module and for coupling light signals into the receiver. The light transmitter and the receiver are both arranged on the first side of the carrier, a shielding means serving to shield the receiver from optical and/or electrical interference signals. As a result, a bidirectional optoelectronic module is provided which is distinguished by signal conversion that is as precise as possible and, at the same time, is comparatively cost-effective in terms of production.

Abstract: The invention relates to an electro-optical arrangement for coupling light signals into an optical waveguide, which has a laser diode for emitting light signals and a microlens, which focuses light signals emitted by the laser for coupling into the optical waveguide. According to the invention, the microlens is arranged on a carrier carrying the laser diode.

Abstract: A passive radiation optical system includes a one-piece module having a plurality of individual optical components wherein the one-piece module is radiation-permeable or reflective. The optical components are connected to one another via predetermined breaking points for forming a radiation optical system module. In addition, the one-piece module can be separated to form optical components that include one or more individual optical components. The one-piece module is particularly for use with light emitting diodes. The passive radiation optical system module is suitable for mass production, and because of its modular principle, it enables flexible adaptation to the shape and size of the desired lighting device, such as lighted advertising or safety lighting.

Abstract: The invention relates to a bidirectional emitting and receiving module and includes a support having a top face and a bottom face, an emitting component disposed on the top face that emits light having a first wavelength, and a receiving component arranged on the bottom face that receives light having a second wavelength. The support includes a slanted boundary surface that is coated with a wavelength-selective mirror, and light emitted by the emitting component is reflected and deflected on the mirror, while light that is emitted by the emitting component and is to be received by the receiving component is refracted thereon into the adjacent medium. Such light is refracted on the boundary surface, penetrates the support, and leaves the support on the bottom face thereof, and is then detected by the receiving component.

Abstract: An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.