Abstract: In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.

Abstract: In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.

Abstract: Bulk acoustic wave resonators having a lateral energy barrier are disclosed. In an example aspect, a resonator includes a volume of piezoelectric material, a bottom electrode, a top electrode, and a reflector. The bottom electrode is disposed below a portion of a lower surface of the volume of piezoelectric material. The top electrode is disposed above a portion of an upper surface of the volume of piezoelectric material with a portion of the top electrode overlapping a portion of the bottom electrode to define an active region of the volume of piezoelectric material configured to resonate acoustic waves having frequencies within a specified passband. The reflector is disposed on an upper surface of the volume of piezoelectric material outside of the active region with the reflector configured as a lateral energy barrier to reflect laterally propagating acoustic waves having frequencies within the specified passband.

Abstract: The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

Abstract: A microacoustic component includes a functional acoustic region, an inner marginal region and an outer marginal region. The cover covers the functional acoustic region and has a thin film and a bearing surface. The inner marginal region is acoustically coupled to the functional acoustic region and the bearing surface bears directly at least on a part of the inner marginal region.

Abstract: The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

Abstract: A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.

Abstract: A microacoustic component includes a functional acoustic region, an inner marginal region and an outer marginal region. The cover covers the functional acoustic region and has a thin film and a bearing surface. The inner marginal region is acoustically coupled to the functional acoustic region and the bearing surface bears directly at least on a part of the inner marginal region.

Abstract: A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.

Abstract: A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.

Abstract: A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter.

Abstract: For gluing stress-sensitive component substrates (BS) having a system carrier (ST), it is proposed to provide spacing structures (AS) between the two surfaces to be glued, the structures assuring a defined arrangement of the two surfaces to be glued. The spacing structures can be created through a screening process, and the space between the spacing structures can be filled with glue (K).