Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

Abstract: A wafer oriented includes a mechanism for rotating a wafer and a wafer orientation sensor. The wafer orientation sensor includes a light source for emitting light, a light sensor for sensing the light emitted by the light source as an edge of the wafer is rotated between the light source and the sensor and for producing a sensor signal representative of the sensed light, and an optical filter positioned between the light source and the light sensor. The optical filter has a light-transmission characteristic wherein light in the pass band of the wafer is blocked. When the wafer orientation sensor is used for sensing gallium arsenide wafers, the optical filter is selected to block light at wavelengths greater than about 860 nanometers.

Abstract: A wafer orienter includes a mechanism for rotating a wafer and a wafer orientation sensor. The wafer orientation sensor includes a light source for emitting light, a light sensor for sensing the light emitted by the light source as an edge of the wafer is rotated between the light source and the sensor and for producing a sensor signal representative of the sensed light, and an optical filter positioned between the light source and the light sensor. The optical filter has a light-transmission characteristic wherein light in the pass band of the wafer is blocked. When the wafer orientation sensor is used for sensing gallium arsenide wafers, the optical filter is selected to block light at wavelengths greater than about 860 nanometers.

Abstract: Connectors with a barrel-shaped ferrule are produced from an intermediate which is embodied by metallic strip consisting of a plurality of connector blanks linked together by interconnecting means, each blank comprising a first ferrule-forming part and a second tongue-forming part, and including a first zone which comprises all the first parts, and an adjacent second zone which comprises all the second parts and all the interconnecting means, the side edges of neighbouring first parts in the strip being separated by free interspaces and a continuous layer or cover of insulating material being adhesively applied on the first zone, on at least one obverse surface of the strip, so as to extend beyond a terminal edge of the first part, the said layer being within said interspaces cut through and bent so as to form at least one flap sufficiently large to adhere when folded back.

Abstract: A contact element such as an end-sleeve or a cable shoe, having a connecting portion and a contact portion, is produced from an originally plane blank which has a substantially rectangular first part, which in the finished product defines said connecting portion, and a second part, which in the finished product defines said contact portion. A plurality of such blanks is joined into a metallic punching band with an obverse face and a reverse face and comprising a first zone with all the first parts of the blanks, and a second zone with all the second parts of blanks. On at least the obverse face of the first zone is an insulating cover or coating applied before the individual blanks are removed from the punching band, so that the contact elements having a metallic connection portion with an insulating layer are obtained.