Abstract: A substrate cassette for housing several substrates stacked on top of each other, in particular wafers, has a housing that comprises a first side and a second side that is parallel to the first side, wherein at least an elongated first support is provided for a substrate within the housing between the sides, said support being spaced apart at least in sections from the first side, wherein the first side is closest to said at least one first support.

Abstract: A substrate cassette for housing several substrates stacked on top of each other, in particular wafers, has a housing that comprises a first side and a second side that is parallel to the first side, wherein at least an elongated first support is provided for a substrate within the housing between the sides, said support being spaced apart at least in sections from the first side, wherein the first side is closest to said at least one first support.

Abstract: An end effector for holding substrates has a multi-layered main body and a fluid channel which is provided in the main body. The main body has a receiving end and a fastening end, and include at least two layers, wherein at least one of the layers is not inherently stable, and is formed from a synthetic material film.

Abstract: A suction apparatus for an end effector has a main body, which has a through-channel and a contact surface, and a sealing lip. The contact surface has an edge and recesses, wherein the through-channel issues into the recesses and the recesses terminate in front of the edge. The main body has a base portion and a fastening portion, which adjoins the base portion. In the fastening portion connection channels are provided which are in fluid communication with the through-channel and extend from the edge of the fastening portion. An end effector and a method of producing an end effector are also shown.

Abstract: The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by a gas cushion. The gas cushion is generated by a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate.

Abstract: A suction apparatus for an end effector has a main body, which has a through-channel and a contact surface, and a sealing lip. The contact surface has an edge and recesses, wherein the through-channel issues into the recesses and the recesses terminate in front of the edge. The main body has a base portion and a fastening portion, which adjoins the base portion. In the fastening portion connection channels are provided which are in fluid communication with the through-channel and extend from the edge of the fastening portion. An end effector and a method of producing an end effector are also shown.

Abstract: An end effector for holding substrates has a multi-layered main body and a fluid channel which is provided in the main body. The main body has at least two layers, wherein at least one of the layers is not inherently stable.

Abstract: The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by means of a gas cushion. The gas cushion is generated by means of a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate (FIG. 1).