Abstract: A sputtering target, magnetron sputtering source using the sputtering target, and vacuum coating apparatus using the magnetron source, wherein the performance of the target is improved by providing a concave ring shaped sputtering surface on the target which is continuously curved between an inner rim area and an outer rim area of the target.

Abstract: Cathode disintegration targets which during sputtering are exposed to a very high thermal load have heretofore been pressed against a cooling support from the side to be sputtered by means of bars and screws, to cool them. According to invention it is proposed to make the target plate in several parts and to provide on the sides where the individual parts abut mutually correlated cutouts, pairs of which form a cavity into which an auxiliary element, preferably a plate with threaded bores, can be inserted for attachment from the cooling support side.

Abstract: A multiple holder for substrates to be treated, particularly finish-ground spectacle lenses to be cleaned and then coated, comprises four arms 1a to 1d forming a rectangular cross. On their sides facing the four quadrants, the arms are provided with grooves for receiving the substrates 11 to be treated which substrates are forced by springs 4a to 4d to engage the grooves. The holder is used primarily for the secure holding and transportation of substrates during a sequence of treating operations.

Abstract: A wafer support, comprising, a baseplate with an aperture therein and a hing ring rotatably positioned in the aperture. A platform is defined in the holding ring for supporting the peripheral edges of a wafer disposed therein and the holding ring includes a plurality of spaced slots extending parallel to the platform and spaced therefrom. A plurality of retaining rods are connected to the baseplate and extend into the slots to engage over the wafer positioned on the platform. A portion of the holding ring adjacent each slot defines a retaining rod abutment for urging each retaining rod out of its respective slot when the holding rod is rotated in the baseplate to release the supported wafer.