Patents by Inventor Bernhard Gebauer
Bernhard Gebauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10271421Abstract: Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.Type: GrantFiled: April 27, 2017Date of Patent: April 23, 2019Assignee: Avago Technologies International Sales Pte. LimitedInventors: Bernhard Gebauer, Oliver Wiedenmann, Sarah Haney, Lueder Elbrecht, Deog-Soon Choi, Aaron Lee
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Patent number: 10129972Abstract: An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.Type: GrantFiled: October 30, 2015Date of Patent: November 13, 2018Assignee: Avago Technologies International Sales Pte. LimitedInventors: Martin Fritz, Bernhard Gebauer, Lueder Elbrecht, Martin Handtmann, Oliver Wiedenmann, Sergej Scherer
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Publication number: 20180098417Abstract: Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.Type: ApplicationFiled: April 27, 2017Publication date: April 5, 2018Inventors: Bernhard Gebauer, Oliver Wiedenmann, Sarah Haney, Lueder Elbrecht, Deog-Soon Choi, Aaron Lee
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Publication number: 20170215281Abstract: An apparatus includes electrically conductive structures disposed over, or partially in, a dielectric layer. The dielectric layer has a first relative permittivity (?r1). The apparatus also includes a dielectric via disposed in the dielectric layer. The dielectric via has a second relative permittivity (?r2) that is less than the first relative permittivity (?r1). The dielectric via is located in a region, or adjacent to the region, where a magnitude of an electric field between the first and second electrically conductive structures is comparatively large.Type: ApplicationFiled: January 27, 2016Publication date: July 27, 2017Inventors: Martin Fritz, Bernhard Gebauer
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Publication number: 20170127523Abstract: An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.Type: ApplicationFiled: October 30, 2015Publication date: May 4, 2017Inventors: Martin Fritz, Bernhard Gebauer, Lueder Elbrecht, Martin Handtmann, Oliver Wiedenmann, Sergej Scherer
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Patent number: 9312212Abstract: A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.Type: GrantFiled: July 8, 2013Date of Patent: April 12, 2016Assignee: Infineon Technologies AGInventors: Klaus-Guenter Oppermann, Martin Franosch, Bernhard Gebauer
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Publication number: 20130292855Abstract: A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.Type: ApplicationFiled: July 8, 2013Publication date: November 7, 2013Inventors: Klaus-Guenter Oppermann, Martin Franosch, Bernhard Gebauer
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Patent number: 8501534Abstract: A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.Type: GrantFiled: July 16, 2008Date of Patent: August 6, 2013Assignee: Infineon Technologies AGInventors: Klaus-Guenter Oppermann, Martin Franosch, Bernhard Gebauer
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Publication number: 20130043961Abstract: A duplexer includes first and second filters, and a first shielding bondwire. The first filter includes a first bondwire connecting the first filter to a printed circuit board, the first bondwire forming a portion of a first virtual loop having a first virtual area, where first current passing through the first bondwire generates a first magnetic field. The second filter includes a second bondwire connecting the second filter to the printed circuit, the second bondwire forming a portion of a second virtual loop having a second virtual area. The first shielding bondwire includes first and second ends connected to a conductor of the printed circuit board to form a closed electrical first shielding loop having a corresponding first shielding area. The magnetic field induces shielding current in the first shielding loop, which generates a first compensating magnetic field that attenuates the first magnetic field.Type: ApplicationFiled: August 15, 2011Publication date: February 21, 2013Applicant: Avago Technologies Wireless IP (Singapore) Pte.LtdInventors: Bernhard Gebauer, Martin Handtmann
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Patent number: 8193877Abstract: A duplexer includes first and second acoustic filters and a phase shifter. The first acoustic filter is connected between an antenna and the transmitter, and has a first passband. The second acoustic filter is connected between the antenna and the receiver, and has a second passband. The phase shifter includes at least one series capacitor connected in series with the antenna and at least one shunt inductor connected between the at least one capacitor and ground. The phase shifter is connected between the antenna and the first filter when the first passband is higher than the second passband, and provides a negative phase shift of an output impedance of the first filter. The phase shifter is connected between the antenna and the second filter when the second passband is higher than the first passband, and provides a negative phase shift of an input impedance of the second filter.Type: GrantFiled: November 30, 2009Date of Patent: June 5, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Martin Fritz, Martin Handtmann, Ji-Fuh Liang, Bernhard Gebauer
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Patent number: 8018303Abstract: An apparatus includes a stacked crystal filter and a bulk acoustic wave resonator, which are acoustically coupled.Type: GrantFiled: October 12, 2007Date of Patent: September 13, 2011Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Martin Handtmann, Jyrki Kaitila, Robert Thalhammer, Bernhard Gebauer
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Publication number: 20110128092Abstract: A duplexer includes first and second acoustic filters and a phase shifter. The first acoustic filter is connected between an antenna and the transmitter, and has a first passband. The second acoustic filter is connected between the antenna and the receiver, and has a second passband. The phase shifter includes at least one series capacitor connected in series with the antenna and at least one shunt inductor connected between the at least one capacitor and ground. The phase shifter is connected between the antenna and the first filter when the first passband is higher than the second passband, and provides a negative phase shift of an output impedance of the first filter. The phase shifter is connected between the antenna and the second filter when the second passband is higher than the first passband, and provides a negative phase shift of an input impedance of the second filter.Type: ApplicationFiled: November 30, 2009Publication date: June 2, 2011Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Martin FRITZ, Martin HANDTMANN, Ji-Fuh LIANG, Bernhard GEBAUER
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Patent number: 7816997Abstract: An antenna multiplexer with a pi-network circuit is described, having an inductance connected in series and, on each of the two connection sides of the inductance, a capacitance connected in parallel. The pi-network circuit is used for effecting an impedance mismatch of a signal path of the antenna multiplexer.Type: GrantFiled: September 26, 2007Date of Patent: October 19, 2010Assignee: Infineon Technologies AGInventors: Hans-Peter Forstner, Bernhard Gebauer, Ngoc-Hoa Huynh
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Publication number: 20100013032Abstract: A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.Type: ApplicationFiled: July 16, 2008Publication date: January 21, 2010Inventors: Klaus-Guenter Oppermann, Martin Franosch, Bernhard Gebauer
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Publication number: 20090096550Abstract: An apparatus includes a stacked crystal filter and a bulk acoustic wave resonator, which are acoustically coupled.Type: ApplicationFiled: October 12, 2007Publication date: April 16, 2009Inventors: Martin Handtmann, Jyrki Kaitila, Robert Thalhammer, Bernhard Gebauer
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Publication number: 20080079648Abstract: An antenna multiplexer with a pi-network circuit is described, comprising an inductance connected in series and, on each of the two connection sides of the inductance, a capacitance connected in parallel. The pi-network circuit is used for effecting an impedance mismatch of a signal path of the antenna multiplexer.Type: ApplicationFiled: September 26, 2007Publication date: April 3, 2008Inventors: Hans-Peter Forstner, Bernhard Gebauer, Ngoc-Hoa Huynh