Abstract: An optical arrangement for use in an optical imaging device includes an optical element unit and a detection device and/or an actuating device. The optical element unit includes at least one optical element. The detection device determines in a plurality of M degrees of freedom in each case a detection value which is representative of a relative position or orientation of an element reference of the optical element in relation to a primary reference of the detection device in the respective degree of freedom. The detection device includes a plurality of N detection units, each of which outputs a detection signal which is representative of a distance and/or a displacement of the detection unit in relation to a secondary reference assigned to the optical element and the respective detection unit.

Abstract: An optical arrangement for use in an optical imaging device includes an optical element unit and a detection device and/or an actuating device. The optical element unit includes at least one optical element. The detection device determines in a plurality of M degrees of freedom in each case a detection value which is representative of a relative position or orientation of an element reference of the optical element in relation to a primary reference of the detection device in the respective degree of freedom. The detection device includes a plurality of N detection units, each of which outputs a detection signal which is representative of a distance and/or a displacement of the detection unit in relation to a secondary reference assigned to the optical element and the respective detection unit.

Abstract: An optical imaging arrangement includes an optical projection system, a support structure system and a control device. The optical projection system includes a group of optical elements supported by the support structure system and configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate. The group of optical elements includes a first optical element and a second optical element and the control device includes a sensor device and an active device. The sensor device is functionally associated to the first optical element and is configured to capture mechanical disturbance information representative of a mechanical disturbance acting on the first optical element in at least one degree of freedom up to all six degrees of freedom.

Abstract: A lithography system has a projection lens that includes a first optical element and a first sensor subframe. The projection lens also includes first sensor which is configured to detect a position of the first optical element with respect to the first sensor subframe. The projection lens further includes a second sensor which is configured to detect a position of a wafer with respect to the first sensor subframe.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A lithography system has a projection lens that includes a first optical element and a first sensor subframe. The projection lens also includes first sensor which is configured to detect a position of the first optical element with respect to the first sensor subframe. The projection lens further includes a second sensor which is configured to detect a position of a wafer with respect to the first sensor subframe.

Abstract: An optical imaging arrangement includes an optical element unit, and an actuator device connected to the optical element unit and is configured to be connected to a support structure for supporting the optical unit. The actuator device is configured to: actively adjust, in an adjustment state, a position and/or an orientation of the optical unit with respect to the support structure in N degrees of freedom; and support the optical element unit in a statically overdetermined manner in at least one of the N degrees of freedom via a plurality of active first and second actuator components such that, in a holding state following the adjustment state, the first and second actuator components cause a parasitic residual load introduced into the optical element unit in the at least one of the N degrees of freedom.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Abstract: A projection exposure system (10) includes: a mask holding device (14), a substrate holding device (36), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system, which defined position is mechanically uncoupled from the position of the mask holding device. The projection exposure system also includes a detector (52) arranged to record an image of the measurement structure imaged by the projection optics. During operation of the system, the imaging of the mask structures and of the measurement structure takes place at the same time by the projection optics. An evaluation device (54) establishes a lateral position of the image of the measurement structure in the area of the detector during the exposure process.

Abstract: An optical imaging arrangement includes an optical element unit, and an actuator device connected to the optical element unit and is configured to be connected to a support structure for supporting the optical unit. The actuator device is configured to: actively adjust, in an adjustment state, a position and/or an orientation of the optical unit with respect to the support structure in N degrees of freedom; and support the optical element unit in a statically overdetermined manner in at least one of the N degrees of freedom via a plurality of active first and second actuator components such that, in a holding state following the adjustment state, the first and second actuator components cause a parasitic residual load introduced into the optical element unit in the at least one of the N degrees of freedom.

Abstract: An optical imaging arrangement includes an optical projection system, a support structure system and a control device. The optical projection system includes a group of optical elements supported by the support structure system and configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate. The group of optical elements includes a first optical element and a second optical element and the control device includes a sensor device and an active device. The sensor device is functionally associated to the first optical element and is configured to capture mechanical disturbance information representative of a mechanical disturbance acting on the first optical element in at least one degree of freedom up to all six degrees of freedom.

Abstract: An optical projection unit includes first and second optical element modules. The first optical element module includes a first housing unit and a first optical element received within the first housing unit and having an optically used first region defining a first optical axis. The second optical element module is located adjacent to the first optical element module and includes a second optical element which defines a second optical axis of the optical projection unit. The first housing unit has a central first housing axis and an outer wall extending in a circumferential direction about the first housing axis. The first optical axis is laterally offset and/or inclined with respect to the first housing axis. The first housing axis is substantially collinear with the second optical axis.

Abstract: A projection exposure system (10) for microlithography which includes: a mask holding device (14) holding a mask (18) with mask structures (20) disposed on the mask, a substrate holding device (36) holding a substrate (30), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system (10), which defined position is mechanically uncoupled from the position of the mask holding to device (14). The projection exposure system (10) also includes a detector (52) arranged to record an image of the measurement structure (48) imaged by the projection optics (26). The projection exposure system (10) is configured such that during operation of the projection exposure system (10) the imaging of the mask structures (20) and the imaging of the measurement structure (48) take place at the same time by the projection optics (26.

Abstract: An optical projection unit includes first and second optical element modules. The first optical element module includes a first housing unit and a first optical element received within the first housing unit and having an optically used first region defining a first optical axis. The second optical element module is located adjacent to the first optical element module and includes a second optical element which defines a second optical axis of the optical projection unit. The first housing unit has a central first housing axis and an outer wall extending in a circumferential direction about the first housing axis. The first optical axis is laterally offset and/or inclined with respect to the first housing axis. The first housing axis is substantially collinear with the second optical axis.

Abstract: A projection exposure system (10) for microlithography which includes: a mask holding device (14) holding a mask (18) with mask structures (20) disposed on the mask, a substrate holding device (36) holding a substrate (30), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system (10), which defined position is mechanically uncoupled from the position of the mask holding to device (14). The projection exposure system (10) also includes a detector (52) arranged to record an image of the measurement structure (48) imaged by the projection optics (26). The projection exposure system (10) is configured such that during operation of the projection exposure system (10) the imaging of the mask structures (20) and the imaging of the measurement structure (48) take place at the same time by the projection optics (26.

Abstract: An optical projection unit includes first and second optical element modules. The first optical element module includes a first housing unit and a first optical element received within the first housing unit and having an optically used first region defining a first optical axis. The second optical element module is located adjacent to the first optical element module and includes a second optical element which defines a second optical axis of the optical projection unit. The first housing unit has a central first housing axis and an outer wall extending in a circumferential direction about the first housing axis. The first optical axis is laterally offset and/or inclined with respect to the first housing axis. The first housing axis is substantially collinear with the second optical axis.

Abstract: A projection exposure system (10) for microlithography which includes: a mask holding device (14) holding a mask (18) with mask structures (20) disposed on the mask, a substrate holding device (36) holding a substrate (30), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system (10), which defined position is mechanically uncoupled from the position of the mask holding device (14). The projection exposure system (10) also includes a detector (52) arranged to record an image of the measurement structure (48) imaged by the projection optics (26). The projection exposure system (10) is configured such that during operation of the projection exposure system (10) the imaging of the mask structures (20) and the imaging of the measurement structure (48) take place at the same time by the projection optics (26.

Abstract: Lithography apparatus and device manufacturing methods are disclosed in which means are provided for reducing the extent to which vibrations propagate between a first element of a projection system and a second element of a projection system. Approaches disclosed include the use of plural resilient members in series as part of a vibration isolation system, plural isolation frames for separately supporting first and second projection system frames, and modified connection positions for the interaction between the first and second projection system frames and the isolation frame(s).

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.