Patents by Inventor Bernhard Hartmann
Bernhard Hartmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240117998Abstract: Example embodiments relate to a device for heating a medium and air. A heating source generates thermal energy by the combustion of a fuel-air-mixture. A heat exchanger serves to heat air passed along an exterior side, has an interior space into which flue gas generated during combustion of the fuel-air-mixture flows, has a fin structure on the exterior side, and transmits thermal energy to the medium pipe. The electric heating element generates thermal energy, the heat exchanger having integral structures for accommodating the electric heating element and the medium pipe. The medium pipe and the electric heating element are guided around the interior space of the heat exchanger.Type: ApplicationFiled: January 3, 2022Publication date: April 11, 2024Inventors: Thomas HARTMANN, Bernhard STAHL
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Patent number: 8261614Abstract: A rotational speed sensor including at least one substrate, at least two base elements which each have a frame, a means for suspending the frame from the substrate, at least one seismic mass and one means for suspending the seismic mass from the frame. One or more drive means are provided for driving one or more base elements and one or more reading devices. The at least two base elements are coupled to one another by means of at least one coupling bar.Type: GrantFiled: March 12, 2007Date of Patent: September 11, 2012Assignee: Continental Teves AG & Co. oHGInventors: Bernhard Hartmann, Stefan Günthner
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Publication number: 20100037690Abstract: A rotational speed sensor including at least one substrate, at least two base elements which each have a frame, a means for suspending the frame from the substrate, at least one seismic mass and one means for suspending the seismic mass from the frame. One or more drive means are provided for driving one or more base elements and one or more reading devices. The at least two base elements are coupled to one another by means of at least one coupling bar.Type: ApplicationFiled: March 12, 2007Publication date: February 18, 2010Applicant: Continental Teves AG & Co. oHGInventors: Stefan Günthner, Bernhard Hartmann
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Publication number: 20090031806Abstract: The present invention relates to a micromechanical rotational rate sensor with a substrate (9), at least one base element (1) that is suspended by at least one spring element (11, 11?) on the substrate (9), which base element comprises at least one seismic or inertial mass (3), an excitation means (8) and with a read-out arrangement (15). According to the invention, the spring element (11, 11?) is movable perpendicularly to the motion direction (X, Y) of the base element (1).Type: ApplicationFiled: March 12, 2007Publication date: February 5, 2009Applicant: Conti Temic Microelectronic GmbHInventors: Bernhard Hartmann, Stefan Guenthner
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Publication number: 20080276706Abstract: Disclosed is a rotational rate sensor with a substrate, at least one basic element (1) which comprises a frame (2), a suspension (7) of the frame (2) on the substrate, at least one vibration facility (3) and a suspension (4, 5) of the vibration facility (3) on the frame (2), a drive device (8) and a reading facility (9, 10). The drive device (8) is designed in such a manner that it acts on the frame (2) of the basic element (1).Type: ApplicationFiled: September 27, 2005Publication date: November 13, 2008Applicant: CONTI TEMIC MICROELECTRONIC GMBHInventors: Bernhard Hartmann, Konrad Kasper, Reinhard Gottinger, Stefan Gunthner
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Publication number: 20080039992Abstract: A sensor arrangement for detecting movements, which is designed as a monolithic arrangement and in which several sensors are integrated. A first sensor is provided to detect a linear acceleration and a second sensor to detect a yaw rate. The sensor arrangement also comprises a third sensor for detecting yaw acceleration.Type: ApplicationFiled: March 16, 2005Publication date: February 14, 2008Inventors: Peter Lohberg, Alexander Kolbe, Bernhard Hartmann
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Publication number: 20060121735Abstract: The invention relates to processes for the formation of isolation structures for micro-machined sensors in single-crystal surface technology. In known processes, silicon structures defined by deep trenches are etched and uncovered by a “release etch” step also at their bottom surface towards the substrate. The subsequent lining of these trenches with a non-conducting insulating material, such as silicon dioxide leads to a firm anchoring by means of a surrounding of the silicon structure with the lined trenches on three sides, leaving one side uncovered. It is the main idea of the invention—instead of lining the trenches—to convert thin-walled silicon into an electrically non-conducting material. This can, for instance, be accomplished by means of a thermal oxidation of narrow silicon ribs released prior thereto by trenches. In the minimal configuration, two trenches (holes) per rib with the required structure depth must be etched for this purpose.Type: ApplicationFiled: September 12, 2003Publication date: June 8, 2006Inventors: Matthias Aikele, Albert Engelhardt, Marcus Frey, Bernhard Hartmann, Helmut Seidel
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Patent number: 6966224Abstract: Micromachined vibratory gyroscope having two or more coplanar movable masses suspended over a planar substrate. Two perpendicular axes (x and y) are defined within the substrate plane, while a third, the z-axis or input axis, is defined to be perpendicular to the substrate plane. The movements of the two masses along the x-axis are coupled through an electrostatic coupling means so that the natural resonant frequency of the in-phase mode and that of the anti-phase mode are separated from each other for the resonances along the x-axis. When the two masses are driven to vibrate along the x-axis in the anti-phase mode and the device experiences rotation about the z-axis, Coriolis forces act differentially on the masses in the Y-direction, causing the two masses to dither in an anti-phase motion along the y-axis. The anti-phase dithering along the y-axis can be sensed directly by a rate sensor to measure the rate of rotation about the z-axis.Type: GrantFiled: March 2, 2004Date of Patent: November 22, 2005Assignees: BEI Technologies, Inc., Conti Temic Microelectronic GmgH, Continental Teves AG & Co. oHGInventors: Hai Yan, Roland Burghardt, Bernhard Hartmann, Konrad Kapser, Matthias Rose
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Publication number: 20040173023Abstract: Micromachined vibratory gyroscope having two or more coplanar movable masses suspended over a planar substrate. Two perpendicular axes (x and y) are defined within the substrate plane, while a third, the z-axis or input axis, is defined to be perpendicular to the substrate plane. The movements of the two masses along the x-axis are coupled through an electrostatic coupling means so that the natural resonant frequency of the in-phase mode and that of the anti-phase mode are separated from each other for the resonances along the x-axis. When the two masses are driven to vibrate along the x-axis in the anti-phase mode and the device experiences rotation about the z-axis, Coriolis forces act differentially on the masses in the Y-direction, causing the two masses to dither in an anti-phase motion along the y-axis. The anti-phase dithering along the y-axis can be sensed directly by a rate sensor to measure the rate of rotation about the z-axis.Type: ApplicationFiled: March 2, 2004Publication date: September 9, 2004Inventors: Hai Yan, Roland Burghardt, Bernhard Hartmann, Konrad Kapser, Matthias Rose
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Patent number: 6483160Abstract: A micromechanical enclosure suitable for micromechanical sensors, particularly acceleration sensors in the field of automotive vehicles, includes a micromechanical structure on a substrate, a conductor track layer connected to the micromechanical structure on the main surface of the substrate, a cover that covers a part of the main surface of the substrate, and a level compensation layer arranged next to the conductor track layer beneath the contact area during the manufacture of the wafer. A planarizing layer, which forms a level surface, may additionally be applied above this, to form a level area on the substrate which can easily be joined to a level area of the cover by means of a metallic wafer bond. This achieves small overall dimensions and avoids a glass frit bond.Type: GrantFiled: July 19, 2001Date of Patent: November 19, 2002Assignees: DaimlerChrysler AG, Temic Telefunken microelectronic GmbHInventors: Albert Engelhardt, Bernhard Hartmann, Ulrich Prechtel, Helmut Seidel
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Publication number: 20020008317Abstract: 1.Type: ApplicationFiled: July 19, 2001Publication date: January 24, 2002Inventors: Albert Engelhardt, Bernhard Hartmann, Ulrich Prechtel, Helmut Seidel
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Patent number: 5377597Abstract: Rail vehicle with at least two car bodies wherein at or near their connecting point a truck is provided which carries both car bodies, wherein furthermore an intermediate link is arranged between the car bodies, and one car body is rotatably mounted at the intermediate link about a lateral axis, and the other car body is rotatably mounted at the intermediate link about a vertical axis.Type: GrantFiled: April 26, 1993Date of Patent: January 3, 1995Assignee: Man GHH Schienenverkehrstechnik GmbHInventors: Wolfgang-Dieter Richter, Wolfgang David, Engelbert Weeger, Bernhard Hartmann