Patents by Inventor Bernhard Lange
Bernhard Lange has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9458401Abstract: The use of substituted diureas, polyureas, bisurethanes or polyurethanes of the formula R1X—CO—NR3R4 in which X is R2N or O and R1 to R4 are each independently hydrogen, alkyl radicals, alkenyl radicals, cycloalkyl radicals, aryl radicals or arylalkyl radicals, where at least one variable must be a radical having at least 4 carbon atoms and where the urea or urethane functionality must be replicated via bridging members, for improvement of the use properties of mineral and synthetic nonaqueous industrial fluids.Type: GrantFiled: March 4, 2013Date of Patent: October 4, 2016Assignee: BASF SEInventors: Jan Strittmatter, Karl Haeberle, Wolfgang Grabarse, Ivette Garcia Castro, Markus Hansch, Irene Troetsch-Schaller, Stephan Schenk, Michael Schroers, Bernhard Lange
-
Patent number: 8884343Abstract: A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is embedded in the laminate body and the semiconductor is bonded to contact pads of the substrate by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.Type: GrantFiled: February 19, 2013Date of Patent: November 11, 2014Assignee: Texas Instruments IncorporatedInventors: Bernhard Lange, Juergen Neuhaeusler
-
Publication number: 20130232858Abstract: The use of substituted monoureas, diureas, polyureas, monourethanes, bisurethanes or polyurethanes of the formula R1X—CO—NR3R4 in which X is R2N or O and R1 to R4 are each independently hydrogen, alkyl radicals, alkenyl radicals, cycloalkyl radicals, aryl radicals or arylalkyl radicals, where at least one variable must comprise 4 carbon atoms and where the urea or urethane functionality may be replicated via bridging members, for further improvement of the cold flow properties of mineral oils and crude oils which already comprise further organic compounds suitable for dispersion or for promoting dispersion of paraffin crystals which precipitate under cold conditions, and organic compounds which improve the cold flow characteristics of mineral oils and crude oils.Type: ApplicationFiled: March 1, 2013Publication date: September 12, 2013Applicant: BASF SEInventors: Jan STRITTMATTER, Karl HAEBERLE, Wolfgang GRABARSE, Ivette GARCIA CASTRO, Markus HANSCH, Irene TROETSCH-SCHALLER, Stephan SCHENK, Michael SCHROERS, Bernhard LANGE
-
Publication number: 20120211895Abstract: A semiconductor device comprising a semiconductor die that is embedded in a package, wherein the die has a front side comprising a plurality of pads to be bonded to terminals of the package, and wherein a backside of the die is coupled to a backside surface of the package by a thermal bridge.Type: ApplicationFiled: February 6, 2012Publication date: August 23, 2012Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventors: Bernhard LANGE, Thies PUCHERT
-
Publication number: 20120193801Abstract: An RFID transponder having a semiconductor die with a solderable contact area and an antenna made from a winding wire, wherein the winding wire is soldered to the contact area, and the solderable contact area is made from a nickel based alloy.Type: ApplicationFiled: January 16, 2012Publication date: August 2, 2012Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventors: Johann Gross, Bernhard Lange
-
Patent number: 7741704Abstract: An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.Type: GrantFiled: October 18, 2007Date of Patent: June 22, 2010Assignees: Texas Instruments Incorporated, Texas Instruments Deutschland GmbHInventors: Bernhard Lange, Steven Kummerl
-
Publication number: 20100019361Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.Type: ApplicationFiled: October 5, 2009Publication date: January 28, 2010Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Steven A. Kummerl, Bernhard Lange, Anthony L. Coyle
-
Patent number: 7531895Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.Type: GrantFiled: October 25, 2006Date of Patent: May 12, 2009Assignee: Texas Instruments IncorporatedInventors: Bernhard Lange, William David Boyd
-
Patent number: 7488623Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: GrantFiled: July 9, 2007Date of Patent: February 10, 2009Assignee: Texas Instruments IncorporatedInventors: Steven A Kummerl, Anthony L Coyle, Bernhard Lange
-
Publication number: 20080093715Abstract: An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.Type: ApplicationFiled: October 18, 2007Publication date: April 24, 2008Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventors: Bernhard Lange, Steven Kummerl
-
Publication number: 20080020517Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.Type: ApplicationFiled: July 31, 2007Publication date: January 24, 2008Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Steven Kummerl, Bernhard Lange, Anthony Coyle
-
Publication number: 20070290303Abstract: A semiconductor device (10) comprises a die (11) provided between a first leadframe (12) and a second leadframe (13), such that a first surface of the die (11) is connected to the first leadframe (12) and a second surface of the die (11) is connected to a second leadframe (13). Mold compound (15) includes side recesses (16) into which end portions (18) of leadframe (12) can be fit.Type: ApplicationFiled: June 5, 2007Publication date: December 20, 2007Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBHInventor: Bernhard Lange
-
Publication number: 20070259484Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: ApplicationFiled: July 9, 2007Publication date: November 8, 2007Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Steven Kummerl, Anthony Coyle, Bernhard Lange
-
Patent number: 7256482Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.Type: GrantFiled: August 12, 2004Date of Patent: August 14, 2007Assignee: Texas Instruments IncorporatedInventors: Steven Alfred Kummerl, Anthony L. Coyle, Bernhard Lange
-
Publication number: 20070181652Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.Type: ApplicationFiled: April 11, 2007Publication date: August 9, 2007Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Bernhard Lange, Steven Kummerl
-
Patent number: 7221055Abstract: According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.Type: GrantFiled: May 23, 2005Date of Patent: May 22, 2007Assignee: Texas Instruments IncorporatedInventor: Bernhard Lange
-
Publication number: 20070057361Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.Type: ApplicationFiled: October 25, 2006Publication date: March 15, 2007Applicant: Texas Instruments IncorporatedInventors: Bernhard Lange, William Boyd
-
Publication number: 20070048996Abstract: A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip with metallization traces, copper lines in contact with the traces, and copper bumps located in an orderly and repetitive arrangement on each line so that the bumps of one line are positioned about midway between the corresponding bumps of the neighboring lines. A substrate is provided which has elongated copper leads with first and second surfaces, the leads oriented at right angles to the lines. The first surface of each lead is connected to the corresponding bumps of alternating lines using solder elements. Finally, the assembly is encapsulated in molding compound so that the second lead surfaces remain un-encapsulated.Type: ApplicationFiled: September 1, 2005Publication date: March 1, 2007Inventors: Bernhard Lange, Anthony Coyle, Quang Mai
-
Publication number: 20070040237Abstract: A high current semiconductor device (for example QFN for 30 to 70 A) with low resistance and low inductance is encapsulated by molding compound (401, height 402 about 0.9 mm) so that the second lead surfaces 110b remain unencapsulated. A copper heat slug (404) may be attached to chip surface (101b) using thermally conductive adhesive (403). Chip surface (101a), protected by an overcoat (103) has metallization traces (102). Copper-filled windows (107) contact the traces and copper layers (105) parallel to traces (102). Copper bumps (108) are formed on each line in an orderly and repetitive arrangement so that the bumps of one line are positioned about midway between the bumps of the neighboring lines. A substrate has elongated leads (110) oriented at right angles to the lines; the leads connect the corresponding bumps of alternating lines.Type: ApplicationFiled: August 22, 2005Publication date: February 22, 2007Inventors: Anthony Coyle, Bernhard Lange
-
Publication number: 20070034993Abstract: A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads (140 . . . ) oriented with one end (140a . . . ) towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.Type: ApplicationFiled: August 15, 2005Publication date: February 15, 2007Inventor: Bernhard Lange