Abstract: A method and a device for processing data in a network domain. The resources of several layers of at least two network elements of the network domain are determined. The thus determined resources are utilized for path processing in the network domain. Furthermore, a communication system is provided with the device.

Abstract: An electrical contact-making element for electrical carrier components in an electronic housing is particularly suited for automotive applications. The electrical contact-making element is in the form of a U-shaped plug pin having a base limb and two side limbs. There is provided a robust, reliable electrical contact connection between a plurality of electrical carrier components, such as printed circuit boards, for example, which ensures secure contact is made even in the case of external influences such as vibrations, for example, and can be fitted, by way of a simple press-in mechanism, at the end of the fitting process.

Abstract: The invention relates to a combined fastening and contacting system for electrical components on superimposed circuit boards in an electronic housing, especially for the automobile sector, as well as a method for fastening and contacting electrical components. The novel fastening and contacting system has two parts, one of which is embodied as a holding frame for electrical components while the other part is configured as a pressing frame for fixing the holding frame. There is formed a combined fastening and contacting system for electrical components on superimposed circuit boards, which makes it possible to replace faulty electrical components in a simple fashion while allowing superimposed circuit boards to be electrically contacted in a safe manner. The system is particularly suitable for the automobile sector.

Abstract: In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.

Abstract: The invention relates to a combined fastening and contacting system for electrical components on superimposed circuit boards in an electronic housing, especially for the automobile sector, as well as a method for fastening and contacting electrical components. The novel fastening and contacting system has two parts, one of which is embodied as a holding frame for electrical components while the other part is configured as a pressing frame for fixing the holding frame. There is formed a combined fastening and contacting system for electrical components on superimposed circuit boards, which makes it possible to replace faulty electrical components in a simple fashion while allowing superimposed circuit boards to be electrically contacted in a safe manner. The system is particularly suitable for the automobile sector.

Abstract: An electrical contact-making element for electrical carrier components in an electronic housing is particularly suited for automotive applications. The electrical contact-making element is in the form of a U-shaped plug pin having a base limb and two side limbs. There is provided a robust, reliable electrical contact connection between a plurality of electrical carrier components, such as printed circuit boards, for example, which ensures secure contact is made even in the case of external influences such as vibrations, for example, and can be fitted, by way of a simple press-in mechanism, at the end of the fitting process.

Abstract: In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.

Abstract: First and second chips each having a transistor are provided. The first chips are arranged along a first axis on a first metallic body in side-by-side and interspaced manner. The second chips are arranged parallel to the first axis on a second metallic body in a side-by-side and interspaced manner. The second chips are arranged perpendicular to the first axis opposite an area of the first body and are each connected to the opposite area via at least one bonding connection. The first chips, with regard to the third axis, are arranged opposite an area of the second body, which is located between adjacent second chips. A third metallic body is arranged on the second body and comprises projections each of which being arranged on one of the areas of the second body. The first chips are each connected to the opposite projection via at least one bonding connection.

Abstract: First and second chips each having a transistor are provided. The first chips are arranged along a first axis on a first metallic body in side-by-side and interspaced manner. The second chips are arranged parallel to the first axis on a second metallic body in a side-by-side and interspaced manner. The second chips are arranged perpendicular to the first axis opposite an area of the first body and are each connected to the opposite area via at least one bonding connection. The first chips, with regard to the third axis, are arranged opposite an area of the second body, which is located between adjacent second chips. A third metallic body is arranged on the second body and comprises projections each of which being arranged on one of the areas of the second body. The first chips are each connected to the opposite projection via at least one bonding connection.